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IC资料

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IC封装资料_电源管理芯片_LTC4415IDHC_PBF.pdf
LTC441514415faTypicalapplicaTionFeaTuresDescripTionDual4AIdealDiodeswithAdjustableCurrentLimitTheLTC®4415containstwomonolithicPow...
2024-12-12494435.08 KB20页172
IC封装资料_电容_CL10F105ZP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121920259.58 KB3页140
IC封装资料_电容_GRM155R61E104MA87D.pdf
GRM155R61E104MA87_(0402,X5R:EIA,0.1uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121266970.8 KB30页97
IC封装资料_电容_C3216X5R1V226M160AC.pdf
August2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201i...
2024-12-129511.67 MB57页208
IC封装资料_接口及驱动芯片_MAX3232ECD.pdf
RXTXPOWER3.3V,5VDINROUTDOUTRS232RINRS2322222ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTIC...
2024-12-1215212.43 MB29页28
IC封装资料_电容_CL10B103KB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B103KB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121241361.14 KB3页239
IC封装资料_电容_CL10F153ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F153ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121978360.21 KB3页85
IC封装资料_电容_CL10B103KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B103KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12886361.13 KB3页72
IC封装资料_电容_0805B822K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128241.05 MB27页174
IC封装资料_接口及驱动芯片_MAX3284EAUT+T.pdf
PinConfigurationsappearatendofdatasheet.GeneralDescriptionTheMAX3280E/MAX3281E/MAX3283E/MAX3284EaresinglereceiversdesignedforRS-48...
2024-12-123781.36 MB11页18
IC封装资料_电感_WPN4020H4R7MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12892624.92 KB9页82
IC封装资料_电容_GRM1555C1H510JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121885920.26 KB29页15
IC封装资料_电容_GRM1555C1H471JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12707920.26 KB29页268
IC封装资料_电感_WPN4020H3R3MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12838624.92 KB9页70
IC封装资料_电容_CL10F154ZO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F154ZO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121240360.68 KB3页4
IC封装资料_电源管理芯片_LTC4416IMS_PBF.pdf
LTC4416/LTC4416-14416fa36V,LowLossDualPowerPathControllersforLargePFETsTheLTC®4416/LTC4416-1controltwosetsofexternalP-channelMOSF...
2024-12-121182296.71 KB12页287
IC封装资料_电容_CL10F154ZA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F154ZA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-124911.42 MB36页159
IC封装资料_电容_C3216X7R1C106K160AC.pdf
August2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201i...
2024-12-1210181.67 MB57页205
IC封装资料_电源管理芯片_LTC4415IMSE_PBF.pdf
LTC441514415faTypicalapplicaTionFeaTuresDescripTionDual4AIdealDiodeswithAdjustableCurrentLimitTheLTC®4415containstwomonolithicPow...
2024-12-121493435.08 KB20页141
IC封装资料_接口及驱动芯片_MAX3295AUT+T.pdf
GeneralDescriptionTheMAX3293/MAX3294/MAX3295low-power,high-speedtransmittersforRS-485/RS-422commu-nicationoperatefromasingle+3.3Vp...
2024-12-1218622.08 MB12页34

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