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IC资料

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IC封装资料_电容_GRM155R61E105KA12D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1274920.26 KB29页218
IC封装资料_电容_GRM1555C1H511JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12661920.26 KB29页165
IC封装资料_电容_CL10B103KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12812452.9 KB21页74
IC封装资料_电容_CL10F223ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F223ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121336360.22 KB3页136
IC封装资料_电容_0805B823K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1219701.26 MB20页74
IC封装资料_电容_C3216X7R1E335KT000N.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-122651.61 MB56页159
IC封装资料_接口及驱动芯片_NXP74VCH2T45.pdf
1.GeneraldescriptionThe74AVCH2T45isadualbit,dualsupplytransceiverthatenablesbidirectionalleveltranslation.Itfeaturestwodatainput-o...
2024-12-12308232.07 KB29页216
IC封装资料_电感_WPN4020H6R8MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12406624.92 KB9页114
IC封装资料_接口及驱动芯片_NXB0104GU12X.pdf
NXB0104Dualsupplytranslatingtransceiver;autodirectionsensing;3-stateRev.1—11September2019Productdatasheet1.GeneraldescriptionTheN...
2024-12-12470422.18 KB25页99
IC封装资料_电源管理芯片_LTC4417CUF_PBF.pdf
LTC441714417fTypicalapplicaTionFeaTuresDescripTionPrioritizedPowerPath™ControllerTheLTC®4417connectsoneofthreevalidpowersupplies...
2024-12-121271515.8 KB32页155
IC封装资料_电容_CL10F224ZA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F224ZA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1216411.42 MB36页102
IC封装资料_电容_GRM155R61E224KE01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121850920.26 KB29页237
IC封装资料_电容_C3216X7S2A225KT000N.pdf
COM-GEN-006DELIVERYSPECIFICATIONSPEC.No.C-General-fDATE:Aug,2019ToUpontheacceptanceofthisspec.previousspec.(C2011-0454)shallbeabol...
2024-12-121781.79 MB37页68
IC封装资料_接口及驱动芯片_SN74LVC1T45DCKR.pdf
BDIR54A3VCCAVCCBProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICEattheendofthisdatasheetaddr...
2024-12-1219301.64 MB35页167
IC封装资料_电容_CL10B103KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121321259.58 KB3页91
IC封装资料_电容_CL10F224ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F224ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-122951.42 MB36页99
IC封装资料_电容_0805CG0R5C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212441.05 MB27页247
IC封装资料_电容_CL10F224ZA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F224ZA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-129441.42 MB36页35
IC封装资料_电感_WPN201610H1R0MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12485624.92 KB9页56
IC封装资料_电容_C3225X5R0J107M250AC.pdf
SeriesNameCaseSizeCodeTemperatureCharacteristicsRatedVoltageCodeCapacitanceToleranceThicknessCodePackagingCodeSpecialCodeDescripti...
2024-12-1271463.62 KB3页22

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