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IC资料

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IC封装资料_接口及驱动芯片_TXB0104RUTR.pdf
ProcessorPeripheralVCCAVCCBProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTICEattheendofthisda...
2024-12-1218081.45 MB41页12
IC封装资料_电容_CL10B103KB8WPNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1215347.55 MB84页20
IC封装资料_电容_GRM1555C1H560JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12696920.26 KB29页236
IC封装资料_电容_CL10F333ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F333ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12843360.23 KB3页210
IC封装资料_电容_CL10F225ZQ8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12421259.58 KB3页39
IC封装资料_电容_CL10F225ZP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12587259.58 KB3页146
IC封装资料_电容_C4532X7S2A475M230KB.pdf
July2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC1005[0402inch]C1608[0603inch]C2012[0805inch]C3216[1206inch]...
2024-12-122171.26 MB34页76
IC封装资料_晶体管_MMBT4401LT1G.pdf
©SemiconductorComponentsIndustries,LLC,2011October,2011−Rev.101PublicationOrderNumber:MMBT4401LT1/DMMBT4401L,SMMBT4401LSwitching...
2024-12-12301233.76 KB7页172
IC封装资料_电容_0805CG1R5C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128811.05 MB27页253
IC封装资料_电感_WPN201610H100MT.pdf
SunlordIndustrialPark,DafuyuanIndustrialZone,Guanlan,Shenzhen,China518110Tel:0086-755-29832660Fax:0086-755-82269029E-Mail:sunlord@...
2024-12-121797695.55 KB11页43
IC封装资料_晶体管_IRLML5203TR.pdf
ParameterMax.UnitsVDSDrain-SourceVoltage-30VID@TA=25°CContinuousDrainCurrent,VGS@-10V-3.0ID@TA=70°CContinuousDrainCurrent,VGS@-1...
2024-12-121004302.1 KB10页224
IC封装资料_电容_GRM1555C1H561JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121392920.26 KB29页202
IC封装资料_电源管理芯片_LTC6652AHMS8-2.048_PBF.pdf
LTC665216652fgFormoreinformationwww.linear.com/LTC6652FeaturesapplicationsDescriptionPrecisionLowDriftLowNoiseBufferedReferenceThe...
2024-12-1294629.27 KB20页224
IC封装资料_电容_CL10F334ZA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F334ZA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218481.42 MB36页298
IC封装资料_电源管理芯片_LTC4425IMSE_PBF.pdf
LTC442514425faFormoreinformationwww.linear.com/LTC4425TypicalapplicaTionFeaTuresDescripTionLinearSuperCapChargerwithCurrent-Limite...
2024-12-12983721 KB22页202
IC封装资料_电容_CA0612KRX7R7BB104.pdf
ProductSpecification–November10,2015V.4DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSC-ArrayNP0/X7R/Y5V16VTO50Vsizes0508(4x040...
2024-12-1219021.05 MB17页116
IC封装资料_连接器_1827923.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12123936.13 MB445页211
IC封装资料_电容_CL10B103KB85PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12208259.58 KB3页68
IC封装资料_电容_0805CG1R8C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214411.05 MB27页247
IC封装资料_电感_WPN201610U2R2MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121253624.92 KB9页48

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