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IC资料

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IC封装资料_晶体管_ULN2003AJ.pdf
7C6C5C4C3C2C1CCOM76543217B6B5B4B3B2B1B101112131415169ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMP...
2024-12-1216231.39 MB35页150
IC封装资料_电容_0805CG2R5C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125591.05 MB27页149
IC封装资料_电容_GRM1555C1H621JA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12145010.43 MB296页183
IC封装资料_电感_WPN252010H1R0MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121999624.92 KB9页65
IC封装资料_电源管理芯片_LTC6655BHMS8-5_TRPBF.pdf
LTC6655/LTC6655LN1Rev.GFormoreinformationwww.analog.comTYPICALAPPLICATIONDESCRIPTION0.25ppmNoise,LowDriftPrecisionReferencesTheLTC...
2024-12-1215492.42 MB30页193
IC封装资料_电容_CL10B103KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12439259.58 KB3页105
IC封装资料_电容_CL10F473ZO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F473ZO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121215360.81 KB3页3
IC封装资料_电容_CL10F473ZB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F473ZB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12621360.58 KB3页196
IC封装资料_电容_CL10B103KC85PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12274452.9 KB21页57
IC封装资料_电容_CC0201CRNPO8BN6R8.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12264998.46 KB11页227
IC封装资料_晶体管_ULN2003AN.pdf
7C6C5C4C3C2C1CCOM76543217B6B5B4B3B2B1B101112131415169ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMP...
2024-12-1215821.39 MB35页223
IC封装资料_电容_0805CG2R7C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214121.05 MB27页266
IC封装资料_电容_CL10F474ZA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F474ZA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219431.42 MB36页239
IC封装资料_电感_WPN252010H3R3MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121527624.92 KB9页270
IC封装资料_电容_CC0201CRNPO9BN1R0.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-126261.22 MB13页113
IC封装资料_电感_WPN252010H2R2MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121654624.92 KB9页44
IC封装资料_晶振_9HT10.pdf
ElectricalSpecificationsEquivalentSeriesResistance(ESR)FeaturesDimensionsQuartzCrystalsSMDTUNINGFORK9HT10Units:mmNorminalFrequency...
2024-12-1290309.46 KB1页295
IC封装资料_晶振_7XZ.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-124211.18 MB1页216
IC封装资料_电感_WPN252010H1R5MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12452624.92 KB9页34
IC封装资料_连接器_1758157.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12152636.13 MB445页140

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