拖动LOGO至书签栏，立即收藏五八文库

添加五八文库到电脑桌面

已经有10万+用户把五八文库添加到电脑桌面，以后点击桌面图标一键打开，无需搜索，非常快捷！

开通会员限时优惠

登录 | 注册

IC资料

分类:

类型:

IC封装资料_电容_GRM1555C1H680GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121757920.26 KB29页20
IC封装资料_电容_CL10F474ZO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F474ZO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1217391.42 MB36页165
IC封装资料_电容_CL10F474ZB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12256259.57 KB3页250
IC封装资料_电容_CL10F474ZA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F474ZA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121765360.62 KB3页205
IC封装资料_电容_CC0201CRNPO9BN1R2.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-124311.22 MB13页82
IC封装资料_晶振_NX3225SA.pdf
Whenorderingourproducts,specifythemwithan“OrderingCode”thatconsistsofthefollowing:--MIfyouhaveanyqueriesconcerningourstandardfre...
2024-12-121092184.82 KB2页15
IC封装资料_晶振_DSX321G.pdf
DSX221G13～16MHz150Ωmax.16～20MHzFundamentalSeries,8pF,10pF,12pF10μW（200μWmax.）±10×10－6,±20×10－6,±30×10－6,±50×10－...
2024-12-121174289.75 KB1页204
IC封装资料_开关_K2-1107ST-A4SW-06.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12782156.34 KB1页147
IC封装资料_电容_GRM1555C1H680JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12689920.26 KB29页134
IC封装资料_电容_CL10F683ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F683ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121015360.2 KB3页229
IC封装资料_电容_CC0201CRNPO9BN1R5.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-121111.22 MB13页53
IC封装资料_锂电池专用芯片_LP4056HSPF.pdf
AEN(seeNoteA)BChargePumpVCCD−D+1D−1D+2D−2D+SOEDigitalControlProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&Commun...
2024-12-122402.65 MB30页225
IC封装资料_开关_ST-1187.pdf
��...
2024-12-121915914.08 KB8页45
IC封装资料_电容_GRM1555C1H681JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121171920.26 KB29页58
IC封装资料_电容_CL10X106MO8NRNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10X106MO8NRNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210971.28 MB36页142
IC封装资料_电源管理芯片_LTC6655CHMS8-5_PBF.pdf
LTC6655/LTC6655LN1Rev.GFormoreinformationwww.analog.comTYPICALAPPLICATIONDESCRIPTION0.25ppmNoise,LowDriftPrecisionReferencesTheLTC...
2024-12-1211582.42 MB30页203
IC封装资料_电容_CL10F823ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F823ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12896360.21 KB3页236
IC封装资料_电容_CL10B103MB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B103MB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121868360.79 KB3页55
IC封装资料_电容_CL10F684ZP8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F684ZP8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12703360.45 KB3页173
IC封装资料_电容_CL10B103MB8NCNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121710259.58 KB3页216

首页上页 293 294 295 296 297 下页尾页

确认删除?