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IC资料

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IC封装资料_电容_GRM1555C1HR60BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12939920.26 KB29页142
IC封装资料_电容_CL10B104KB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121821259.58 KB3页128
IC封装资料_电容_CL21A106KPFNNNG.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KPFNNNG·Product:Multi-layerCeramicCapacitor...
2024-12-125291.42 MB36页1
IC封装资料_电容_0805CG8R2C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219351.05 MB27页4
IC封装资料_电容_CC0201JRNPO9BN120.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-127531.22 MB13页29
IC封装资料_电容_CL21A106KQCLNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1211361.45 MB36页59
IC封装资料_电感_YNR2510-100M.pdf
SMDPowerInductors-YNR2510Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12626657.99 KB4页170
IC封装资料_电容_GRM155R61H474KE11D.pdf
GRM155R61H474KE11_(0402,X5R:EIA,0.47uF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12840943.66 KB30页105
IC封装资料_连接器_1827965.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12158736.19 MB445页295
IC封装资料_电容_0805CG9R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128581.05 MB27页217
IC封装资料_电感_YNR2510-150M.pdf
SMDPowerInductors-YNR2510Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12560657.99 KB4页93
IC封装资料_电源管理芯片_LTC7812IUH_PBF.pdf
LTC781217812fcFormoreinformationwww.linear.com/LTC7812TYPICALAPPLICATIONDESCRIPTIONLowIQ,38VSynchronousBoost+BuckControllerTheLTC...
2024-12-122532.29 MB44页107
IC封装资料_电容_GRM155R62A104KE14D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121620920.26 KB29页220
IC封装资料_电容_CL10B104KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1219671.45 MB36页121
IC封装资料_电容_0805CG100F101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123391.05 MB27页175
IC封装资料_连接器_1-292133-3.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12745222.7 KB2页270
IC封装资料_连接器_1-292133-2.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121074222.7 KB2页59
IC封装资料_电感_YNR2510-220M.pdf
SMDPowerInductors-YNR2510Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12871657.99 KB4页108
IC封装资料_连接器_1-292133-1.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12548222.7 KB2页172
IC封装资料_电源管理芯片_LTM4611IV_PBF.pdf
LTM461114611fbFormoreinformationwww.linear.com/LTM4611TypicalapplicaTionUltralowVIN,15ADC/DCµModuleRegulator1.5VINto5.5VIN,15ASte...
2024-12-12600569.89 KB30页247

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