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IC资料

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IC封装资料_连接器_1-292133-0.pdf
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2024-12-121157222.7 KB2页256
IC封装资料_电容_GRM1555C1HR70BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12633920.26 KB29页134
IC封装资料_电容_CL10B104KB8NNWC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121127259.58 KB3页59
IC封装资料_电容_CL21A106KQFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KQFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-124891.42 MB36页133
IC封装资料_电容_CL10B104KB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104KB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-125941.45 MB36页17
IC封装资料_电容_CC0201JRNPO9BN200.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121076998.46 KB11页228
IC封装资料_电容_CC0201JRNPO9BN180.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1218761.22 MB13页98
IC封装资料_连接器_1-292133-4.pdf
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2024-12-121188222.7 KB2页166
IC封装资料_电容_0805CG100J101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127211.05 MB27页283
IC封装资料_电容_CL21A106MPFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106MPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-127331.42 MB36页64
IC封装资料_连接器_1-917657-2.pdf
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2024-12-121020191.4 KB1页92
IC封装资料_电感_YNR2512-1R0M.pdf
SMDPowerInductors-YNR2512Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12330661.28 KB5页167
IC封装资料_电源管理芯片_LTM4614EV_PBF.pdf
LTM461414614fbTypicalapplicaTionFeaTuresapplicaTionsDescripTionDual4AperChannelLowVINDC/DCµModuleRegulatorTheLTM®4614isacomplete...
2024-12-121245459.81 KB20页177
IC封装资料_连接器_1-292133-5.pdf
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2024-12-12336222.7 KB2页81
IC封装资料_电容_GRM1555C1HR70WA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12527920.26 KB29页208
IC封装资料_电容_CL21A106MQFNNNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1210027.46 MB84页269
IC封装资料_电容_GRM155R70J104KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12760920.26 KB29页239
IC封装资料_电容_CL10B104KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12286259.58 KB3页60
IC封装资料_电容_CC0201JRNPO9BN220.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-128481.22 MB13页295
IC封装资料_连接器_1-917658-2.pdf
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2024-12-12133193.5 KB1页237

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