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IC资料

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IC封装资料_电容_0805CG270J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128151.05 MB27页220
IC封装资料_电容_GRM1885C1H6R0DA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12849944.07 KB30页7
IC封装资料_电感_YNR4018-330M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12188661.38 KB5页166
IC封装资料_电感_YNR4018-220M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12572661.38 KB5页2
IC封装资料_连接器_1830664.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-128236.13 MB445页91
IC封装资料_连接器_1759046.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-129136.13 MB445页261
IC封装资料_电容_GRM1885C1H6R2BA01D.pdf
GRM1885C1H6R2BA01_(0603,C0G:EIA,6.2pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12439944.1 KB30页123
IC封装资料_电容_GRM1885C1H6R2CA01D.pdf
GRM1885C1H6R2CA01_(0603,C0G:EIA,6.2pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12850944.1 KB30页248
IC封装资料_电容_CL21B104KCFWPNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-121357.55 MB84页228
IC封装资料_电源管理芯片_MAX17225ELT+T.pdf
GeneralDescriptionTheMAX17220–MAX17225isafamilyofultra-lowquiescentcurrentboost(step-up)DC-DCconverterswitha225mA/0.5A/1Apeakindu...
2024-12-121890992.67 KB23页91
IC封装资料_电容_GRM1885C1H6R8BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12622944.07 KB30页293
IC封装资料_电容_GRM155R71C473KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12868920.26 KB29页17
IC封装资料_电容_CL21B105KAFNFNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KAFNFNE·Product:Multi-layerCeramicCapacitor...
2024-12-121416361.17 KB3页167
IC封装资料_电容_CL21B104MBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-128251.45 MB36页223
IC封装资料_电容_CL10B105KP8VPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121716259.58 KB3页73
IC封装资料_电容_GRM1885C1H6R8CA01D.pdf
GRM1885C1H6R8CA01_(0603,C0G:EIA,6.8pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12415944.09 KB30页194
IC封装资料_电容_CL10B105KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12739259.58 KB3页271
IC封装资料_电容_0805CG271J101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213271.05 MB27页147
IC封装资料_电容_CL21B105KAFNNNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1218027.46 MB84页159
IC封装资料_电感_YNR4018-680M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12222661.38 KB5页33

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