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IC资料

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IC封装资料_电容_GRM1885C1H7R0BA01D.pdf
GRM1885C1H7R0BA01_(0603,C0G:EIA,7pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121576944.09 KB30页256
IC封装资料_电感_YNR4018-470M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12745661.38 KB5页11
IC封装资料_电容_GRM1885C1H6R8DA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121671944.07 KB30页234
IC封装资料_电源管理芯片_MAX40200AUK+T.pdf
GeneralDescriptionTheMAX40200isanidealdiodecurrent-switchthatdropssolittlevoltagethatitapproachesanorderofmagnitudebetterthanSchot...
2024-12-121844646.27 KB14页99
IC封装资料_电容_GRM1885C1H7R0DA01D.pdf
GRM1885C1H7R0DA01_(0603,C0G:EIA,7pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121568944.09 KB30页115
IC封装资料_电容_GRM1885C1H7R0CA01D.pdf
GRM1885C1H7R0CA01_(0603,C0G:EIA,7pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1260944.09 KB30页226
IC封装资料_电容_CL21B105KOFNFNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KOFNFNE·Product:Multi-layerCeramicCapacitor...
2024-12-12158456.17 KB3页118
IC封装资料_电容_GRM155R71C563KA88D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121323920.26 KB29页57
IC封装资料_电容_CL10B105KQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-125731.45 MB36页192
IC封装资料_电容_CL21B105KBFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KBFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-124511.45 MB36页61
IC封装资料_电容_CL21B105KBFNFNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KBFNFNE·Product:Multi-layerCeramicCapacitor...
2024-12-126121.45 MB36页173
IC封装资料_电容_0805CG300J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125791.05 MB27页258
IC封装资料_电容_GRM1885C1H7R5CA01D.pdf
GRM1885C1H7R5CA01_(0603,C0G:EIA,7.5pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121618944.11 KB30页137
IC封装资料_电感_YNR4030-1R0M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12455664.95 KB5页230
IC封装资料_电容_CL21B106KOQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21A106KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1212401.42 MB36页84
IC封装资料_电源管理芯片_MC78M05BDTRKG.pdf
©SemiconductorComponentsIndustries,LLC,2016March,2016−Rev.281PublicationOrderNumber:MC78M00/DMC78M00,MC78M00A,NCV78M00Series500m...
2024-12-121006222.17 KB15页84
IC封装资料_电容_CL21B105KPFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1215841.46 MB36页224
IC封装资料_电容_CC0402CRNPO9BN2R2.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12112217.81 MB176页258
IC封装资料_电容_GRM155R71C683KA88D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1265920.26 KB29页60
IC封装资料_电容_CL10B105KQ8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B105KQ8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-12964361.82 KB3页1

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