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IC资料

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IC封装资料_电容_CL31A225KC9LNNL.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-124227.55 MB84页229
IC封装资料_电源管理芯片_MP2639AGR-P.pdf
MP2639A2-CellLi-IonorLi-PolymerSwitchingChargerCompatiblewith5VInputandIntegrated,BidirectionalCharge/DischargeMP2639ARev.1.0www.M...
2024-12-1217622.03 MB35页184
IC封装资料_电容_GRM155R71H471KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121071920.26 KB29页106
IC封装资料_电容_CL10B223KA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B223KA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121166361.49 KB3页294
IC封装资料_连接器_A0801AWR-11-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-12536334.91 KB1页252
IC封装资料_连接器_A0801AWR-10-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-12382334.91 KB1页94
IC封装资料_电容_0805F476M6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129541.05 MB27页192
IC封装资料_连接器_A0801AWR-09-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-12671334.91 KB1页277
IC封装资料_连接器_A0801AWR-08-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-121266334.91 KB1页113
IC封装资料_电感_YNR8040-6R8M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12449666.38 KB5页254
IC封装资料_电感_YNR8040-4R7M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12381666.38 KB5页218
IC封装资料_连接器_A0801AWR-07-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-12626334.91 KB1页189
IC封装资料_电源管理芯片_MP3422GG-Z.pdf
MP34226.5A,600kHzHighEfficiency,SynchronousStep-UpConverterwithOutputDisconnectin2x2mmQFNPackageMP3422Rev.1.01www.MonolithicPower....
2024-12-1256538.16 KB16页261
IC封装资料_电容_GRM1885C1H562JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121424944.07 KB30页136
IC封装资料_电容_GRM155R71H472KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12305920.26 KB29页256
IC封装资料_电容_CL31A226KAHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31A226KAHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1218051.48 MB36页142
IC封装资料_连接器_A0801AWR-15-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-121243334.91 KB1页165
IC封装资料_连接器_A0801AWR-14-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-121675334.91 KB1页275
IC封装资料_电容_CL10B223KA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B223KA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121259361.48 KB3页104
IC封装资料_电容_0805F563M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213751.05 MB27页97

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