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IC资料

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IC封装资料_电容_GRM1885C1H510JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12794944.07 KB30页300
IC封装资料_电容_0805F475M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210141.05 MB27页97
IC封装资料_电容_GRM1885C1H472JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12973944.07 KB30页122
IC封装资料_电容_CL31A106KAHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31A106KAHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-12501.45 MB36页250
IC封装资料_电感_YNR6045-681M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12902672.55 KB6页188
IC封装资料_电容_CL21X226MQQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21X226MQQNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1211241.48 MB36页43
IC封装资料_连接器_A0801AWR-02-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-12884334.91 KB1页263
IC封装资料_电感_YNR6045-680M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121520672.55 KB6页86
IC封装资料_连接器_61300611121.pdf
12345ABCDSIZEA4REVDATEFILEBYH22-MAR-12TKPGGI16-JUN-15PCNPA6TAKJ31-JUL-15PACKAGINGAKAPPROVAL:GMoUNIT:MMDESCRIPTION:2.54MMPINHEADERS...
2024-12-121852732.18 KB3页180
IC封装资料_电源管理芯片_MP2459GJ-Z.pdf
MP24590.5A,55V,480kHzStep-DownConverterinaTSOT23-6MP2459Rev.1.0www.MonolithicPower.com13/4/2013MPSProprietaryInformation.PatentPro...
2024-12-12154969.82 KB13页188
IC封装资料_连接器_61300411121.pdf
12345ABCDSIZEA4REVDATEFILEBYH22-MAR-12TKPGGI16-JUN-15PCNPA6TAKJ31-JUL-15PACKAGINGAKAPPROVAL:GMoUNIT:MMDESCRIPTION:2.54MMPINHEADERS...
2024-12-121193732.18 KB3页218
IC封装资料_连接器_532611771.pdf
更多资料下载请到五八文库wk.58sms.comDETAILZ注釈NOTE1.コネクタ53261**19の詳細寸法については図面SD-53261-024をご参照ください。REFERT...
2024-12-12275597.48 KB6页290
IC封装资料_电容_0805F475M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123551.05 MB27页181
IC封装资料_电容_GRM1885C1H511JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12756944.07 KB30页185
IC封装资料_电感_YNR8040-1R0M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121055666.38 KB5页46
IC封装资料_电源管理芯片_MP2562DS-LF-Z.pdf
MP25621A,4MHz,50VStep-DownConverterMP2562Rev.1.0www.MonolithicPower.com12/28/2014MPSProprietaryInformation.UnauthorizedPhotocopyan...
2024-12-12366561.02 KB20页11
IC封装资料_电容_CL31A106MBHNNNE.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12722452.9 KB21页80
IC封装资料_电容_GRM155R71H392KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12785920.26 KB29页40
IC封装资料_电容_CL31A106KOHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31A106KOHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1213661.45 MB36页48
IC封装资料_连接器_A0801AWR-04-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-121236334.91 KB1页251

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