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IC资料

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IC封装资料_电容_CL31A476MPHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31A476MPHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-123381.48 MB36页291
IC封装资料_电容_CL31A475KOHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31A475KOHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-12741.45 MB36页251
IC封装资料_电容_CC0402JRNPO9BN221.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1231917.81 MB176页280
IC封装资料_连接器_A2001WV-8P.pdf
A2001SERIESCHANGJIANGCONNECTORSTEL:+86-755-2995911929959129FAX:+86-755-29959139Http://www.CJT.cn2.00mmpitchwiretoboardconnectorSpe...
2024-12-121696404 KB6页172
IC封装资料_连接器_A1254WR-S-10P.pdf
A1254SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn1.25mmpitchwiretoboardconnectorSpeci...
2024-12-121442281.76 KB3页191
IC封装资料_电容_GRM1885C1H681JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121749944.07 KB30页16
IC封装资料_电容_CL31B102KBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31F334ZBCNNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210171.45 MB36页125
IC封装资料_电容_GRM155R71H561KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12412920.26 KB29页130
IC封装资料_连接器_A2001WV-S-5P.pdf
A2001SERIESCHANGJIANGCONNECTORSTEL:+86-755-2995911929959129FAX:+86-755-29959139Http://www.CJT.cn2.00mmpitchwiretoboardconnectorSpe...
2024-12-12149404 KB6页61
IC封装资料_电容_CL10B223KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B223KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12722397.59 KB3页102
IC封装资料_连接器_A2001WV-S-4P.pdf
A2001SERIESCHANGJIANGCONNECTORSTEL:+86-755-2995911929959129FAX:+86-755-29959139Http://www.CJT.cn2.00mmpitchwiretoboardconnectorSpe...
2024-12-121433404 KB6页91
IC封装资料_电容_CL10B223KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12227259.58 KB3页236
IC封装资料_电容_0805F823M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126231.05 MB27页63
IC封装资料_连接器_A2001WV-S-3P.pdf
A2001SERIESCHANGJIANGCONNECTORSTEL:+86-755-2995911929959129FAX:+86-755-29959139Http://www.CJT.cn2.00mmpitchwiretoboardconnectorSpe...
2024-12-121416404 KB6页228
IC封装资料_电容_GRM1885C1H682JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121075944.07 KB30页239
IC封装资料_电感_YNR8040-152M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12396666.38 KB5页168
IC封装资料_电容_CL31B103KBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31F334ZBCNNNC·Product:Multi-layerCeramicCapacitor...
2024-12-128651.45 MB36页145
IC封装资料_电感_YNR8040-151M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12759666.38 KB5页299
IC封装资料_电容_CL31B102KGFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31B102KGFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-122951.45 MB36页124
IC封装资料_电源管理芯片_MS621FE.pdf
MicroBatteryProductCatalogue2017Micro-EnergyDivisionwhomanufacturestheproductsdescribedinthiscatalogholdstheISO9001qualitymanageme...
2024-12-122203.99 MB24页168

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