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IC资料

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IC封装资料_连接器_A2541HWV-2P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121967815.16 KB16页178
IC封装资料_连接器_A2001WV-S-6P.pdf
A2001SERIESCHANGJIANGCONNECTORSTEL:+86-755-2995911929959129FAX:+86-755-29959139Http://www.CJT.cn2.00mmpitchwiretoboardconnectorSpe...
2024-12-12509404 KB6页39
IC封装资料_电容_GRM155R71H562KA88D.pdf
GRM155R71H562KA88_(0402,X7R:EIA,5600pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12556971.06 KB30页229
IC封装资料_电容_CL10B223KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12398452.9 KB21页179
IC封装资料_电容_GRM1885C1H750JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121574944.07 KB30页282
IC封装资料_电容_0805F824M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214431.05 MB27页182
IC封装资料_电容_CL31B103KGFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31B103KGFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1218631.45 MB36页57
IC封装资料_电感_YNR8040-220M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12696666.38 KB5页12
IC封装资料_电容_GRM1885C1H751JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121205944.07 KB30页188
IC封装资料_连接器_A2541HWV-4P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121041814.63 KB16页73
IC封装资料_连接器_A2541HWV-3P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121877815.09 KB16页68
IC封装资料_电源管理芯片_MS621FE-FL11E.pdf
MicroBatteryProductCatalogue2017Micro-EnergyDivisionwhomanufacturestheproductsdescribedinthiscatalogholdstheISO9001qualitymanageme...
2024-12-124273.99 MB24页42
IC封装资料_电容_GRM1885C1H820FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121955944.07 KB30页13
IC封装资料_电容_GRM155R71H563KE14D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12325920.26 KB29页211
IC封装资料_电容_CL10B223KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12722259.58 KB3页118
IC封装资料_电容_CL31B105KAHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31B105KAHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-121361.45 MB36页42
IC封装资料_电容_CL31B104KBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31F334ZBCNNNC·Product:Multi-layerCeramicCapacitor...
2024-12-127691.45 MB36页228
IC封装资料_电容_CL10B223KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12657259.58 KB3页161
IC封装资料_连接器_A2541HWV-8P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121121814.66 KB16页298
IC封装资料_电容_0805N4R7C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210961.26 MB20页133

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