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IC资料

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IC封装资料_电容_GRM1885C1H820JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12375944.07 KB30页295
IC封装资料_电容_CL31B225KBHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31B225KBHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-128331.47 MB36页289
IC封装资料_电容_CL10B223KO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B223KO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121785361.37 KB3页247
IC封装资料_电容_0805N101G500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218061.26 MB20页115
IC封装资料_电容_CL31B106KOHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31B106KOHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1210871.45 MB36页184
IC封装资料_电感_YNR8040-471M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12148666.38 KB5页83
IC封装资料_电容_CL31B106KBHNNNE.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121848452.9 KB21页44
IC封装资料_电源管理芯片_MT3111.pdf
MT3111断点续传单线300/900ns归零码三通道LED恒流驱动控制芯片V1.01概述芯片是断点续传单线300/900ns归零码三通道LED（发光二极管显示器）...
2024-12-121318483.86 KB7页172
IC封装资料_连接器_A2541HWV-13P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12573814.9 KB16页139
IC封装资料_电容_CL10B224JO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121552259.58 KB3页56
IC封装资料_连接器_A2541HWV-12P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12684814.86 KB16页61
IC封装资料_电容_CL10B223MB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B223MB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121525360.81 KB3页230
IC封装资料_电容_GRM1885C1H821JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121025944.07 KB30页217
IC封装资料_电容_0805N101J201CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214741.26 MB20页89
IC封装资料_电容_CL31B226KPHNFNE.pdf
1.Model:CL31B226KPHNFNE2.DescriptionPartno.Size(inch(mm))Thickness(mm)TemperaturecharateristicsCapacitancevalueCapacitancetoleranc...
2024-12-121187141.53 KB1页293
IC封装资料_电感_YNR8040-680M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121356666.38 KB5页222
IC封装资料_电容_CL31B225KCHSNNE.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL31B225KCHSNNEProduct:Multi-layerCeramicCapacitor...
2024-12-125371.43 MB36页91
IC封装资料_连接器_A2541HWV-15P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121396814.87 KB16页115
IC封装资料_电源管理芯片_MT3608.pdf
1AerosemiTechnologyCo.,LtdMT3608AEROSEMIHighEfficiency1.2MHz2AStepUpConverterFEATURES•Integrated80mΩPowerMOSFET•2Vto24VInputVol...
2024-12-121588690.53 KB7页174
IC封装资料_连接器_A2541HWV-14P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12526814.88 KB16页201

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