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IC资料

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IC封装资料_电容_CC0402JRX7R9BB152.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-124671.22 MB13页102
IC封装资料_连接器_AFC01-S30H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-121711.58 MB1页248
IC封装资料_电源管理芯片_REF196GSZ-REEL.pdf
PrecisionMicropower,LowDropoutVoltageReferencesDataSheetREF19xSeriesRev.LInformationfurnishedbyAnalogDevicesisbelievedtobeaccurate...
2024-12-121846598.33 KB28页271
IC封装资料_电容_GRM1885C2A681JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12482944.07 KB30页83
IC封装资料_电源管理芯片_REF195ESZ-REEL.pdf
PrecisionMicropower,LowDropoutVoltageReferencesDataSheetREF19xSeriesRev.LInformationfurnishedbyAnalogDevicesisbelievedtobeaccurate...
2024-12-121042598.33 KB28页188
IC封装资料_电容_GRM188R60J105KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12330944.07 KB30页128
IC封装资料_电容_GRM1885C2A680JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12282944.07 KB30页72
IC封装资料_电容_CL10B331KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121015259.58 KB3页91
IC封装资料_电容_CC0402JRX7R9BB221.pdf
ProductSpecification–June16,2017V.18DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralPurpose&HighCapacitanceClass2,X7R6.3V...
2024-12-1218871.61 MB20页84
IC封装资料_电容_CL10B331KB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12823259.58 KB3页91
IC封装资料_连接器_AFC01-S31FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1210501.85 MB10页38
IC封装资料_电容_CC0402JRX7R9BB331.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12135998.46 KB11页141
IC封装资料_电感_YP0402-151M.pdf
SMDPowerInductors-YP0402Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121212771.92 KB4页161
IC封装资料_连接器_AFC01-S32FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1217491.85 MB10页208
IC封装资料_电感_YP0402-150M.pdf
SMDPowerInductors-YP0402Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121309771.92 KB4页69
IC封装资料_连接器_AFC01-S31H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-1218771.58 MB1页44
IC封装资料_电容_GRM1885C2A820JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121467944.07 KB30页92
IC封装资料_电容_GRM188R60J106KE47D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12314944.07 KB30页101
IC封装资料_电容_GRM1885C2A750JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12449944.07 KB30页29
IC封装资料_电容_CL10B331KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B331KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12874361.14 KB3页142

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