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IC资料

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IC封装资料_连接器_AFC01-S34FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1217431.85 MB10页21
IC封装资料_电容_GRT31CR61H106ME01L.pdf
GRT31CR61H106ME01_(1206,X5R:EIA,10uF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121673958.76 KB30页84
IC封装资料_电源管理芯片_REF3020AIDBZR.pdf
REF3012REF3020REF3025REF3030REF3033REF3040SBVS032F–MARCH2002–REVISEDAUGUST2008DESCRIPTIONTheREF30xxisaprecision,lowpower,lowvolt...
2024-12-12833718.95 KB17页231
IC封装资料_电容_CC0402KPX7R9BB103.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219591.22 MB13页91
IC封装资料_电容_CL10B332KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B332KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-121361.41 MB36页38
IC封装资料_电容_0805X226M6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211851.05 MB27页69
IC封装资料_连接器_AFC01-S34H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-1218931.58 MB1页163
IC封装资料_电容_GRT155R61C105KE01D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-121575.94 MB73页128
IC封装资料_电感_YP0402-470M.pdf
SMDPowerInductors-YP0402Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12191771.92 KB4页182
IC封装资料_电感_YP0402-331M.pdf
SMDPowerInductors-YP0402Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12287771.92 KB4页229
IC封装资料_电容_CC0402KRX5R5BB224.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1217161.22 MB13页4
IC封装资料_电源管理芯片_REF3025AIDBZR.pdf
350300250200150100500DropoutVoltage(mV)051015202530LoadCurrent(mA)5ΩADS7822VCCCSDOUTDCLOCKVREF+In–InGND++1Fto10Fμμ1Ftoμ10Fμ3...
2024-12-12551.51 MB29页149
IC封装资料_电容_CC0402KRNPO9BN221.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1210691.22 MB13页270
IC封装资料_电容_GRM188R60J106ME47J.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1225910.43 MB296页262
IC封装资料_连接器_AFC01-S35H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-124781.58 MB1页48
IC封装资料_连接器_AFC01-S35FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-127751.85 MB10页248
IC封装资料_电容_EGD2DM100F12OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12123415.39 MB230页52
IC封装资料_电容_CL10B332KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12224259.57 KB3页99
IC封装资料_电容_0805X226M100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212881.05 MB27页143
IC封装资料_电感_YP0402-471M.pdf
SMDPowerInductors-YP0402Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121107771.92 KB4页123

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