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IC资料

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IC封装资料_电容_EGS2GM3R3F12OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12149715.39 MB230页220
IC封装资料_电容_CL10B332MB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121779259.58 KB3页53
IC封装资料_电感_YP0502-151M.pdf
SMDPowerInductors-YP0502Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121141721.52 KB5页259
IC封装资料_电感_YP0502-150M.pdf
SMDPowerInductors-YP0502Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12549721.52 KB5页115
IC封装资料_电源管理芯片_RS3002-3_3YE3L.pdf
RS3002REVA.41www.run-ic.com150mA,UltralowPowerConsumption,HighVoltageCMOSLDORegulatorFEATURES•UltralowQuiescentCurrentIQ:2.5µATy...
2024-12-121879660.04 KB15页280
IC封装资料_电容_GRM188R61A226ME15D.pdf
GRM188R61A226ME15_(0603,X5R:EIA,22uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-12110943.54 KB30页86
IC封装资料_连接器_AFC01-S60FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-122591.85 MB10页240
IC封装资料_电容_CL10B333JB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B333JB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121475360.62 KB3页262
IC封装资料_连接器_AFC01-S59H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-1215011.58 MB1页201
IC封装资料_电容_CL10B333JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B333JB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121043360.63 KB3页137
IC封装资料_电容_JMK316BJ226KL-T.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1279510.43 MB296页18
IC封装资料_电容_1206B104K251NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127761.05 MB27页14
IC封装资料_电容_1206B104K101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212201.05 MB27页164
IC封装资料_电感_YP0502-221M.pdf
SMDPowerInductors-YP0502Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121285721.52 KB5页265
IC封装资料_电容_EGS2GM6R8G12OC.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12162115.39 MB230页61
IC封装资料_电感_YP0502-220M.pdf
SMDPowerInductors-YP0502Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121621721.52 KB5页92
IC封装资料_电源管理芯片_RS3002-3_3YSF3.pdf
RS3002REVA.41www.run-ic.com150mA,UltralowPowerConsumption,HighVoltageCMOSLDORegulatorFEATURES•UltralowQuiescentCurrentIQ:2.5µATy...
2024-12-121706660.04 KB15页158
IC封装资料_电容_GRM188R61A335KE15D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121699944.07 KB30页8
IC封装资料_连接器_AFC11-S04ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-1215551.4 MB10页276
IC封装资料_电容_CL10B333KA8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121576259.58 KB3页65

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