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IC资料

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IC封装资料_电源管理芯片_RS3002-5_0SYF5.pdf
RS3002REVA.41www.run-ic.com150mA,UltralowPowerConsumption,HighVoltageCMOSLDORegulatorFEATURES•UltralowQuiescentCurrentIQ:2.5µATy...
2024-12-121773660.04 KB15页63
IC封装资料_连接器_AFC11-S09ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-1213691.4 MB10页104
IC封装资料_电容_GRM188R61A474KA61D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12793944.07 KB30页205
IC封装资料_电容_CL10B333KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12643259.58 KB3页279
IC封装资料_电容_LMK063BJ224MP-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12323653.27 KB26页241
IC封装资料_电容_1206B105K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127351.05 MB27页50
IC封装资料_电容_EGW2EM6R8F09OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1263315.39 MB230页1
IC封装资料_电感_YP0502-471M.pdf
SMDPowerInductors-YP0502Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12252721.52 KB5页144
IC封装资料_电源管理芯片_RS3002-5_0YE3.pdf
RS3002REVA.41www.run-ic.com150mA,UltralowPowerConsumption,HighVoltageCMOSLDORegulatorFEATURES•UltralowQuiescentCurrentIQ:2.5µATy...
2024-12-12605660.04 KB15页277
IC封装资料_电容_CL10B333KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B333KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121363361.13 KB3页145
IC封装资料_电感_YP0502-680M.pdf
SMDPowerInductors-YP0502Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12264721.52 KB5页180
IC封装资料_连接器_AFC11-S12ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-1218711.4 MB10页49
IC封装资料_电容_GRM188R61A475KE15D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121483944.07 KB30页200
IC封装资料_连接器_AFC11-S11ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-1212331.4 MB10页41
IC封装资料_电容_LMK105BJ104KV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12435653.27 KB26页115
IC封装资料_电容_CL10B333KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121517259.58 KB3页19
IC封装资料_电容_LMK105BBJ475MVLF.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12348653.27 KB26页202
IC封装资料_电容_1206B106K100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125031.05 MB27页102
IC封装资料_电容_LMK105B7474KV-F.pdf
注意■本产品目录所记载的内容为2016年10月之内容。因改良等原因，可能会不经预告而变更记载内容，所以请务必在使用前先确认最新的产品信息...
2024-12-1219011.83 MB52页247
IC封装资料_连接器_AFC11-S14ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-126941.4 MB10页41

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