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IC封装资料_电容_1206B221K202NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217571.05 MB27页240
IC封装资料_电源管理芯片_RT9293BGJ6.pdf
RT92931DS9293-01April2011www.richtek.comOrderingInformationNote:Richtekproductsare:�RoHScompliantandcompatiblewiththecurrentrequi...
2024-12-12867400.39 KB13页290
IC封装资料_连接器_AFC11-S46ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-123991.4 MB10页299
IC封装资料_电容_LMK316F226ZL-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-1258653.27 KB26页200
IC封装资料_电容_GRM188R61E224KA88D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12852944.07 KB30页70
IC封装资料_电容_CL10B392KB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12605259.58 KB3页92
IC封装资料_电容_LMK316BJ475ML-T.pdf
注意■本产品目录所记载的内容为2016年10月之内容。因改良等原因，可能会不经预告而变更记载内容，所以请务必在使用前先确认最新的产品信息...
2024-12-127471.83 MB52页193
IC封装资料_电容_1206B221K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215031.05 MB27页112
IC封装资料_电容_EMK107B7105KA-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12736857.12 KB55页126
IC封装资料_电感_YP0504-2R2M.pdf
SMDPowerInductors-YP0504Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12473776.58 KB5页236
IC封装资料_电容_EMK107ABJ475KA-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12817653.27 KB26页128
IC封装资料_电感_YP0504-1R0M.pdf
SMDPowerInductors-YP0504Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12139776.58 KB5页56
IC封装资料_连接器_AFC11-S49ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-122351.4 MB10页216
IC封装资料_电容_GRM188R61E225KA12D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12670944.07 KB30页143
IC封装资料_连接器_AFC11-S48ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-1218721.4 MB10页20
IC封装资料_电容_CL10B392KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B392KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121754361.65 KB3页273
IC封装资料_电容_LMK325BJ226KM-T.pdf
注意■本产品目录所记载的内容为2016年10月之内容。因改良等原因，可能会不经预告而变更记载内容，所以请务必在使用前先确认最新的产品信息...
2024-12-1211901.83 MB52页33
IC封装资料_电容_EMK107BJ105KA-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12760653.27 KB26页164
IC封装资料_电容_CL10B392KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121809259.58 KB3页232
IC封装资料_电容_1206B222K102NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127891.05 MB27页213

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