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IC资料

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IC封装资料_电容_CL10B393KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12562259.58 KB3页66
IC封装资料_电容_MKP1837310161.pdf
DocumentNumber:26017Fortechnicalquestionscontact;dc-film@vishay.comwww.vishay.comRevision:23-Jun-051MKP1837VishayRoedersteinMetall...
2024-12-121785240 KB3页32
IC封装资料_电容_CL10B393KB8NFNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12828452.9 KB21页22
IC封装资料_电容_EMK212B7225KG-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12808857.12 KB55页44
IC封装资料_电容_1206B222K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212011.05 MB27页126
IC封装资料_电容_EMK212B7105KGHTR.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121867653.27 KB26页167
IC封装资料_电感_YP0504-101M.pdf
SMDPowerInductors-YP0504Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12555776.58 KB5页27
IC封装资料_连接器_AFC11-S56ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-1217641.4 MB10页43
IC封装资料_电感_YP0504-100M.pdf
SMDPowerInductors-YP0504Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12883776.58 KB5页146
IC封装资料_电源管理芯片_SE8533K2-HF.pdf
Rev1.0Preliminaryandallcontentsaresubjecttochangewithoutpriornotice.©SeawardElectronics,Inc.,2006.•www.seawardinc.com.cn•Page1S...
2024-12-12819899.38 KB8页139
IC封装资料_连接器_AFC11-S55ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-1210141.4 MB10页261
IC封装资料_电源管理芯片_SE8117T33HF.pdf
Revision11/11/2013Preliminaryandallcontentsaresubjecttochangewithoutpriornotice.©SeawardElectronics,Inc.,2006.•www.seawardinc.co...
2024-12-12382444.91 KB8页74
IC封装资料_电容_QMK325BJ154KN-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121954857.12 KB55页48
IC封装资料_电容_PHV-5R4H505-R.pdf
TechnicalData4403EffectiveJune2017SupersedesAugust2013PHVSupercapacitorsCylindricalpackDescriptionEatonsupercapacitorsareunique,ul...
2024-12-12196494.52 KB3页79
IC封装资料_电容_GRM188R61E475KE15D.pdf
GRM188R61E475KE15_(0603,X5R:EIA,4.7uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121934922.96 KB29页44
IC封装资料_电容_EMK212BJ225MG-TR.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12465653.27 KB26页221
IC封装资料_电容_EMK212BJ225KG-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12162857.12 KB55页252
IC封装资料_电容_CL10B393KO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12254259.58 KB3页39
IC封装资料_电容_CL10B393KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121611259.58 KB3页182
IC封装资料_电容_EMK212BBJ226MG-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12530857.12 KB55页87

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