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IC资料

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IC封装资料_电感_YP0504-220M.pdf
SMDPowerInductors-YP0504Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121484776.58 KB5页190
IC封装资料_连接器_AYF333135.pdf
–1–ACCTB47E201803-TDETAILEDFEATURESForFPCY3B/Y3BWFPC/FFCconnectors(0.3mmpitch)BacklockSlim,pitch0.3mmanddoubletopandbottomcontac...
2024-12-1217671.35 MB14页283
IC封装资料_电感_YP0504-151M.pdf
SMDPowerInductors-YP0504Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12376776.58 KB5页267
IC封装资料_连接器_AT3-1203-R6T-B0.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121468238.91 KB1页199
IC封装资料_连接器_ASP-134604-01.pdf
DONOTSCALEFROMTHISPRINT.040REF1.02.0441.12REF.0501.27REF.280REF7.11.2456.22(INCLUDESK-DOT).0501.27(TYP)1.950049.530(TYP)2.141REF54...
2024-12-121170868.76 KB4页154
IC封装资料_连接器_1759156.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12107836.13 MB445页288
IC封装资料_电容_R76UR32204030J.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comF3034_R76•9/19/20161Oneworld.OneKEMETB...
2024-12-1218592.62 MB25页261
IC封装资料_电容_EMK316BJ225KL-T.pdf
注意■本产品目录所记载的内容为2016年10月之内容。因改良等原因，可能会不经预告而变更记载内容，所以请务必在使用前先确认最新的产品信息...
2024-12-126661.83 MB52页237
IC封装资料_连接器_AYF424035.pdf
–1–ACCTB67E201410-TORDERINGINFORMATIONForFPCY4BHSeriesFPCconnectors(0.4mmpitch)BacklockFEATURES1.Differentialimpedancematching(1...
2024-12-12157421.29 KB8页214
IC封装资料_连接器_AYF530435.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-1211731.1 MB13页133
IC封装资料_电容_RVT0J101M0505-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-129101.08 MB3页149
IC封装资料_连接器_AYF530835.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-1216661.1 MB13页222
IC封装资料_连接器_AYF530635.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-1215911.1 MB13页88
IC封装资料_连接器_AYF530535.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-1219501.1 MB13页91
IC封装资料_电容_RVT0J102M0810-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-122461.08 MB3页180
IC封装资料_电源管理芯片_SE8550X2-HF.pdf
Rev1.0Preliminaryandallcontentsaresubjecttochangewithoutpriornotice.©SeawardElectronics,Inc.,2006.•www.seawardinc.com.cn•Page1S...
2024-12-121634899.38 KB8页102
IC封装资料_电容_GRM188R61H105KAALD.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12800944.07 KB30页152
IC封装资料_连接器_AYF531235.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-1211891.1 MB13页222
IC封装资料_电容_CL10B471KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12410259.58 KB3页223
IC封装资料_连接器_AYF531035.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-122901.1 MB13页215

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