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IC封装资料_电容_1206B224K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211371.05 MB27页106
IC封装资料_电容_RVT0J221M0605-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-1219951.08 MB3页106
IC封装资料_电容_EMK316BJ226KL-T.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12179810.43 MB296页48
IC封装资料_电感_YP0504-221M.pdf
SMDPowerInductors-YP0504Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-1275776.58 KB5页23
IC封装资料_电源管理芯片_SG3525AP013TR.pdf
SG2525ASG3525AREGULATINGPULSEWIDTHMODULATORS.8TO35VOPERATION.5.1VREFERENCETRIMMEDTO±1%.100HzTO500KHzOSCILLATORRANGE.SEPARATEOSCIL...
2024-12-1214231 MB13页290
IC封装资料_电源管理芯片_SG3525ADWR2G.pdf
�SemiconductorComponentsIndustries,LLC,2005January,2005−Rev.51PublicationOrderNumber:SG3525A/DSG3525APulseWidthModulatorControlC...
2024-12-121064231.96 KB10页283
IC封装资料_电容_GRM188R61H105MAALD.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121623944.07 KB30页245
IC封装资料_连接器_AYF531635.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-1215781.1 MB13页194
IC封装资料_连接器_AYF531435.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-122321.1 MB13页254
IC封装资料_电容_CL10B471KB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B471KB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121123361.35 KB3页18
IC封装资料_电容_CL10B471KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B471KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12474361.37 KB3页276
IC封装资料_电容_RVT0J471M0607-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-126821.08 MB3页55
IC封装资料_电容_1206B225K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126081.05 MB27页169
IC封装资料_电容_EMK316BJ475KL-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121618653.27 KB26页188
IC封装资料_连接器_AYF533035.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-125351.1 MB13页30
IC封装资料_电感_YP0504-330M.pdf
SMDPowerInductors-YP0504Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12403776.58 KB5页87
IC封装资料_连接器_AYF532835.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-125821.1 MB13页239
IC封装资料_电源管理芯片_SGM2019-3_3YC5GTR.pdf
SGM2019LowPower,LowDropout,RF-LinearRegulatorsGENERALDESCRIPTIONTheSGM2019serieslow-power,low-noise,low-dropout,CMOSlinearvoltager...
2024-12-12555468.67 KB16页14
IC封装资料_电源管理芯片_SGM2019-3.0YN5G_TR.pdf
SGM2019LowPower,LowDropout,RF-LinearRegulatorsGENERALDESCRIPTIONTheSGM2019serieslow-power,low-noise,low-dropout,CMOSlinearvoltager...
2024-12-12208472.14 KB16页129
IC封装资料_连接器_AYF532435.pdf
–1–ACCTB1E201803-TDETAILEDFEATURESForFPC/FFCY5B/Y5BWFPC/FFCconnectors(0.5mmpitch)BacklockPitch0.5mm,lowprofile/spacesavinganddou...
2024-12-126851.1 MB13页92

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