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IC资料

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IC封装资料_连接器_HTSS-105-01-L-DV-P-TR.pdf
(2.54mm).100"TSS,HTSS,ZSSSERIESZSS–113–03–L–D–0735HTSS–125–01–L–DVDuetotechnicalprogress,alldesigns,specificationsandcomp...
2024-12-12534713.21 KB2页134
IC封装资料_电容_T491B106K020AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-121041.54 MB23页203
IC封装资料_电容_GRM188R71H152KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121549944.07 KB30页41
IC封装资料_电容_T491B106K016AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-129801.54 MB23页284
IC封装资料_电容_CL10B683KO8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12489259.58 KB3页60
IC封装资料_电容_CL10B683KO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B683KO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12935361.04 KB3页153
IC封装资料_电容_GCJ21BR71H224KA01L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-127774.17 MB96页15
IC封装资料_电容_1206CG201J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125751.05 MB27页131
IC封装资料_连接器_KF2EDGCRM-X-7.62-6P.pdf
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2024-12-121277635.93 KB1页17
IC封装资料_电容_1206CG200J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219971.05 MB27页289
IC封装资料_连接器_KF2EDGCRM-X-7.62-5P.pdf
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2024-12-12460635.93 KB1页134
IC封装资料_连接器_KF2EDGCRM-X-7.62-4P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121201635.93 KB1页44
IC封装资料_电感_YPRH1204-470M.pdf
SMDPowerInductors-YPRH1204Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-121235735.47 KB5页199
IC封装资料_电感_YPRH1204-331M.pdf
SMDPowerInductors-YPRH1204Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-121857735.47 KB5页139
IC封装资料_连接器_KF2EDGCRM-X-7.62-3P.pdf
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2024-12-121705635.93 KB1页259
IC封装资料_电源管理芯片_TLV803SDBZR.pdf
3.3�VTLV803SDSP/FPGA/ASICGNDGNDRESETRESETVDD3.3-V�LDOGNDOUTIN5�VVDDProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSuppo...
2024-12-1211711.12 MB22页181
IC封装资料_电容_T491B107K006AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1219951.54 MB23页37
IC封装资料_电容_GRM188R71H153KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12757944.07 KB30页110
IC封装资料_电容_GCJ21BR71H474KA12L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1218974.17 MB96页241
IC封装资料_连接器_KF2EDGCRM-X-7.62-8P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12869635.93 KB1页255

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