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IC资料

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IC封装资料_电容_GCJ21BR71H474KA12L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1218974.17 MB96页241
IC封装资料_连接器_KF2EDGCRM-X-7.62-8P.pdf
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2024-12-12869635.93 KB1页255
IC封装资料_电容_CL10B683MO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B683MO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12971360.77 KB3页227
IC封装资料_连接器_KF2EDGCRM-X-7.62-7P.pdf
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2024-12-12405635.93 KB1页122
IC封装资料_电容_1206CG220J102NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122481.05 MB27页33
IC封装资料_电容_T491B107K010AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1215721.54 MB23页7
IC封装资料_电感_YPRH1204-471M.pdf
SMDPowerInductors-YPRH1204Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-12369735.47 KB5页138
IC封装资料_连接器_KF2EDGCRM-X-7.62-12P.pdf
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2024-12-12796635.93 KB1页54
IC封装资料_连接器_KF2EDGCRM-X-7.62-11P.pdf
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2024-12-12219635.93 KB1页248
IC封装资料_电源管理芯片_TLV803ZDBZR.pdf
3.3�VTLV803SDSP/FPGA/ASICGNDGNDRESETRESETVDD3.3-V�LDOGNDOUTIN5�VVDDProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSuppo...
2024-12-126961.16 MB22页273
IC封装资料_连接器_KF2EDGCRM-X-7.62-10P.pdf
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2024-12-12883635.93 KB1页232
IC封装资料_电容_CL10B684KO8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12889259.58 KB3页57
IC封装资料_连接器_KF2EDGCRM-X-7.62-9P.pdf
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2024-12-121203635.93 KB1页90
IC封装资料_电感_YPRH1204-680M.pdf
SMDPowerInductors-YPRH1204Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-121980735.47 KB5页278
IC封装资料_电容_T491B225K035AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1217951.54 MB23页147
IC封装资料_连接器_1803316.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12144536.13 MB445页145
IC封装资料_电容_T491B107M010AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-128601.54 MB23页271
IC封装资料_电容_GCJ21BR72A103KA01L.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1215595.94 MB73页281
IC封装资料_连接器_KF2EDGCR-X-5.0-3P.pdf
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2024-12-121267620.86 KB1页72
IC封装资料_连接器_KF2EDGCR-X-5.0-2P.pdf
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2024-12-121362620.86 KB1页161

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