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IC资料

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IC封装资料_电容_TAJB105M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12431210.32 KB7页76
IC封装资料_连接器_SM02B-GHS-TB.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121851661.04 KB4页76
IC封装资料_电容_GRM155R71C822KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121449920.26 KB29页76
IC封装资料_电容_CC0402BRNPO9BNR68.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12660998.46 KB11页76
IC封装资料_电容_C4532X7S2A475M230KB.pdf
July2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC1005[0402inch]C1608[0603inch]C2012[0805inch]C3216[1206inch]...
2024-12-122181.26 MB34页76
IC封装资料_电容_CL10CR47BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12529259.58 KB3页76
IC封装资料_电容_CL10C820FB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121045316.18 KB3页76
IC封装资料_过压保护_CD143A-SR70.pdf
*RoHSDirective2002/95/ECJan.27,2003includingannexandRoHSRecast2011/65/EUJune8,2011.**Bournsfollowstheprevailingdefinitionof“halog...
2024-12-12750226.05 KB4页76
IC封装资料_电感_SWPA252010S4R7MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1213531.32 MB22页76
IC封装资料_电容_CL10A106MQ8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A106MQ8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-1212211.28 MB36页76
IC封装资料_电源管理芯片_LTC2955CDDB-1_TRMPBF.pdf
LTC295512955faFormoreinformationwww.linear.com/LTC2955LT3008-3.3VOUTVINPBONINTKILLPGDVINSELLTC2955DDB-12955TA01aGNDTMREN3.3V1MR71M...
2024-12-12374374.33 KB22页76
IC封装资料_电感_SWPA5020S2R2NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1217291.32 MB22页76
IC封装资料_连接器_1751358.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comJan19,2011ExtractfromtheonlinecatalogMKDS1/13-3,5OrderNo.:1751358Thefiguresh...
2024-12-12845225.93 KB5页76
IC封装资料_电源管理芯片_LT3464ETS8_TRPBF.pdf
LT346413464fTYPICALAPPLICATIOUAPPLICATIOSUDESCRIPTIOUFEATURESITinySolutionSizeILowQuiescentCurrent•25µAinActiveMode•0.5µAinShu...
2024-12-12669332.17 KB16页76
IC封装资料_电容_0402N2R7C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215581.26 MB20页76
IC封装资料_电容_0603CG1R5C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1215131.05 MB27页76
IC封装资料_电源管理芯片_LT3013EFE_PBF.pdf
LT301313013feTYPICALAPPLICATIONDESCRIPTION250mA,4Vto80VLowDropoutMicropowerLinearRegulatorwithPWRGDTheLT®3013isahighvoltage,micro...
2024-12-12253310.38 KB20页76
IC封装资料_电源管理芯片_LM2576HVS-3.3_TR.pdf
LM2576/LM2576HV��3A��LM2576��buck��3A��...
2024-12-1217681.05 MB6页76
IC封装资料_电容_GJM0336C1E8R2BB01D.pdf
GJM0336C1E8R2BB01_(0201,C0H:EIA,8.2pF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121865828.28 KB25页76
IC封装资料_电源管理芯片_LT1461CIS8-2.5_TRPBF.pdf
LT146111461fbFormoreinformationwww.linear.com/LT1461TypicalapplicaTionFeaTuresDescripTionMicropowerPrecisionLowDropoutSeriesVoltag...
2024-12-1214031.83 MB18页76

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