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IC封装资料_电容_0805B823K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1219701.26 MB20页74
IC封装资料_电容_CL10B103KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12812452.9 KB21页74
IC封装资料_电源管理芯片_LTC4414EMS8_PBF.pdf
1LTC44144414fc,LT,LTCandLTMareregisteredtrademarksofLinearTechnologyCorporation.PowerPathandThinSOTaretrademarksofLinearTechnology...
2024-12-1290245.13 KB12页74
IC封装资料_电容_GRM1555C1H391JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12198920.26 KB29页74
IC封装资料_过流保护_0451005MRL.pdf
SurfaceMountFuses57©2009Littelfuse,Inc.Specificationsaresubjecttochangewithoutnotice.451/453SeriesNANO2®>VeryFast-Acting>451/453...
2024-12-127341.16 MB4页74
IC封装资料_过流保护_RL16-200.pdf
PositiveThermalCoefficient(PTC)RL16SeriesSpecificationsaresubjecttochangewithoutnotice.Pleaserefertohttp://www.ruilon.com.cnforcur...
2024-12-121419328.49 KB4页74
IC封装资料_电容_0805B473K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-12521.05 MB27页74
IC封装资料_电容_C1005X5R1E105KT000E.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-1211841.61 MB56页74
IC封装资料_电容_CL10C561JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12437259.58 KB3页74
IC封装资料_电源管理芯片_XL7036.pdf
Datasheet2.1A150KHz100VBuckDCtoDCConverterXL7036Rev1.0www.xlsemi.com1Features�OperationVoltagefrom12Vto90V�MaximumDutyCycleupto1...
2024-12-12342321.91 KB10页74
IC封装资料_电容_0805B223K251CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-124521.26 MB20页74
IC封装资料_电容_CL10A105KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12449259.58 KB3页74
IC封装资料_电源管理芯片_LT3465ES6_TRPBF.pdf
LT3465/LT3465A13465afa,LTCandLTareregisteredtrademarksofLinearTechnologyCorporation.ThinSOTisatrademarkofLinearTechnologyCorporati...
2024-12-12433413.26 KB16页74
IC封装资料_电感_NLV32T-151J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121717325.72 KB6页74
IC封装资料_电容_GJM1555C1H3R6BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-127310.43 MB296页74
IC封装资料_电容_0402B681K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217671.05 MB27页74
IC封装资料_电源管理芯片_HX7330 _TO-92.pdf
HX73XX系列Ver2.00(1/7)系列LDO线性稳压器■产品简介系列是一款实用CMOS技术开发的低压差、高精度输出电压、超低功耗电流的正电压型电压稳...
2024-12-121579510.83 KB7页74
IC封装资料_电感_MLF2012E5R6KT000.pdf
February2017INDUCTORSFebruary2017积层铁氧体MLF20122012[0805inch]**表示尺寸代码。JIS[EIA]普通电路用电感器MLF2012型MLF系列更多资料下...
2024-12-12163441.86 KB11页74
IC封装资料_电感_LQW18AN15NG00D.pdf
SpecNo.JELF243A-0024Y-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□00DREFERENCESPECIFICATION1.Scope...
2024-12-121243333.23 KB11页74
IC封装资料_电感_LQP03TN2N0B02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-1264281.03 KB12页74

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