拖动LOGO至书签栏，立即收藏五八文库

添加五八文库到电脑桌面

已经有10万+用户把五八文库添加到电脑桌面，以后点击桌面图标一键打开，无需搜索，非常快捷！

开通会员限时优惠

登录 | 注册

IC资料

分类:

类型:

IC封装资料_电容_GCM21BC71A475KA73L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-128424.17 MB96页73
IC封装资料_电容_TAJC107M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12683210.32 KB7页73
IC封装资料_电容_1206X106M160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217161.05 MB27页73
IC封装资料_电容_T491A106K016AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-121021.54 MB23页73
IC封装资料_连接器_DF12E_3.0_-50DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12354288.67 KB11页73
IC封装资料_电容_CL10B471KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B471KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219061.45 MB36页73
IC封装资料_电容_CL10B334KO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B334KO8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-12127361.35 KB3页73
IC封装资料_连接器_AFC01-S33H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-129281.58 MB1页73
IC封装资料_电容_GRM188R6YA106MA73D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121376944.07 KB30页73
IC封装资料_电容_GRM1885C2A9R0CA01D.pdf
GRM1885C2A9R0CA01_(0603,C0G:EIA,9pF,DC100V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121285943.98 KB30页73
IC封装资料_连接器_A2541HWV-4P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121041814.63 KB16页73
IC封装资料_电容_CL31A475KBHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31A475KBHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1215521.45 MB36页73
IC封装资料_电感_YNR6045-101M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12531672.55 KB6页73
IC封装资料_电容_CL21C270JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210791.45 MB36页73
IC封装资料_电容_CL21C221JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215691.45 MB36页73
IC封装资料_连接器_1830680.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1291236.13 MB445页73
IC封装资料_电容_CL10B105KP8VPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121716259.58 KB3页73
IC封装资料_电容_0805CG101J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211991.05 MB27页73
IC封装资料_电阻_MF3WS1001T.pdf
深圳市咸阳华星机电有限公司SHENZHENXIANYANGHUAXINGMACHINERG&ELECTRONIC.CO;LTD承认书（APPROVESHEET）客户(Customer):品名(Description)...
2024-12-12479645.68 KB13页73
IC封装资料_电容_0805B391K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125931.05 MB27页73

首页上页 440 441 442 443 444 下页尾页

确认删除?