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IC资料

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IC封装资料_连接器_1376383-1.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12976180.45 KB1页74
IC封装资料_连接器_281739-6.pdf
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2024-12-12939162.96 KB1页74
IC封装资料_电容_UMK105B7561KV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12871653.27 KB26页74
IC封装资料_三极管_DMP2225L-7.pdf
DMP2225LDocumentnumber:DS31461Rev.7-31of6www.diodes.comDecember2017©DiodesIncorporatedDMP2225LP-CHANNELENHANCEMENTMODEMOSFETProdu...
2024-12-12432575.54 KB6页74
IC封装资料_电容_AC0603KRX7R9BB102.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-1217361.06 MB24页74
IC封装资料_电容_TAJV336M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121287210.32 KB7页74
IC封装资料_电容_CL10C070BB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12686340.05 KB3页74
IC封装资料_电容_CL10C6R8CB8NNWC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1210541.42 MB36页74
IC封装资料_电感_YP0504-150M.pdf
SMDPowerInductors-YP0504Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121403776.58 KB5页74
IC封装资料_电源管理芯片_SE8117T33HF.pdf
Revision11/11/2013Preliminaryandallcontentsaresubjecttochangewithoutpriornotice.©SeawardElectronics,Inc.,2006.•www.seawardinc.co...
2024-12-12382444.91 KB8页74
IC封装资料_电容_CC0402KRX5R6BB334.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-124831.22 MB13页74
IC封装资料_连接器_A2541HWV-32P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121832814.73 KB16页74
IC封装资料_电容_GRM1885C1H681GA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121829944.07 KB30页74
IC封装资料_连接器_513380274.pdf
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2024-12-121098660.46 KB6页74
IC封装资料_电容_C322J222J30C000.pdf
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2024-12-1218674.24 MB7页73
IC封装资料_三极管_SIE808DF-T1-E3.pdf
VishaySiliconixSiE808DFDocumentNumber:73739S09-1337-Rev.B,13-Jul-09www.vishay.com1N-Channel20-V(D-S)MOSFETFEATURES•Halogen-freeAc...
2024-12-121427282.56 KB10页73
IC封装资料_三极管_PMN55ENEH.pdf
PMN55ENE60V,N-channelTrenchMOSFET14December2017Productdatasheet1.GeneraldescriptionN-channelenhancementmodeField-EffectTransistor(...
2024-12-1290358.64 KB16页73
IC封装资料_电容_CL10C220GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12725316.18 KB3页73
IC封装资料_电源管理芯片_XC6201P332MR-G.pdf
1/27XC6201SeriesPositiveVoltageRegulators■GENERALDESCRIPTIONTheXC6201seriesarehighlyprecise,lowpowerconsumption,positivevoltagere...
2024-12-122011.28 MB27页73
IC封装资料_三极管_DMP2066LSD-13.pdf
DMP2066LSDDocumentnumber:DS31453Rev.5-31of6www.diodes.comMarch2018©DiodesIncorporatedDMP2066LSDD1S1G1D2S2G2DUALP-CHANNELENHANCEME...
2024-12-12730501.65 KB6页73

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