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IC封装资料_电感_VLS252010ET-1R0N.pdf
June2017INDUCTORSPleaserefertoourWebsiteaboutreplacementinformation.CautionTheproductsinthiscatalogisnotrecommendedtoanewdesignWou...
2024-12-121428309.33 KB9页60
IC封装资料_电源管理芯片_LT1764EQ-2.5_TRPBF.pdf
1LT1764Series1764fb3A,FastTransientResponse,LowNoise,LDORegulators■OptimizedforFastTransientResponse■OutputCurrent:3A■DropoutVo...
2024-12-121428360.65 KB20页26
IC封装资料_电容_0402X105K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214281.05 MB27页223
IC封装资料_电容_293D226X0025D2TE3.pdf
293Dwww.vishay.comVishaySpragueRevision:07-Feb-20191DocumentNumber:40002Fortechnicalquestions,contact:tantalum@vishay.comTHISDOCUM...
2024-12-121428568.22 KB24页75
IC封装资料_电容_CC0201CRNPO9BNR50.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121427998.46 KB11页26
IC封装资料_电容_0805B105K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214271.05 MB27页5
IC封装资料_电容_CC0603KRX7R9BB333.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12142717.81 MB176页263
IC封装资料_三极管_SIE808DF-T1-E3.pdf
VishaySiliconixSiE808DFDocumentNumber:73739S09-1337-Rev.B,13-Jul-09www.vishay.com1N-Channel20-V(D-S)MOSFETFEATURES•Halogen-freeAc...
2024-12-121427282.56 KB10页73
IC封装资料_电容_TAJE687K004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121427210.32 KB7页277
IC封装资料_电容_TAJD686M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121427210.32 KB7页103
IC封装资料_电容_1206CG821J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214271.05 MB27页97
AL-XX1361-F8 (A-BRIGHT).pdf
2006/10/19NOTES:1.Alldimensionsareinmillimeters(inches);2.Tolerancesare±0.1mm(0.004inch)unlessotherwisenoted.�SolderingironBasic...
2024-12-111426337.97 KB5页191
IC封装资料_三极管_BST82_215.pdf
ImportantnoticeDearCustomer,On7February2017theformerNXPStandardProductbusinessbecameanewcompanywiththetradenameNexperia.Nexperiais...
2024-12-121426458.28 KB14页203
IC封装资料_连接器_KF2EDGR-Y-3.81-13P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121426192.45 KB1页125
IC封装资料_电源管理芯片_TLV70233DBVR.pdf
TLV702xxGNDENINOUTVINVOUTOnOffCINCOUT1FCeramic�ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTN...
2024-12-1214261.28 MB34页173
IC封装资料_电容_CL10B562JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B562JB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121426360.96 KB3页56
IC封装资料_电容_GRM1885C1H562JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121426944.07 KB30页136
IC封装资料_电感_NLV25T-033J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121426318.58 KB6页106
IC封装资料_电容_GRM1555C1H180GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121425920.26 KB29页257
IC封装资料_电容_GCM1555C1H471JA16D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1214254.17 MB96页106

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