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IC封装资料_电源管理芯片_LM25088MHX-2_NOPB.pdf
BOOTSWCOMPFBRAMPDITH/RESVCCVINOUTCSCSGVOUTENHGGNDLDRsQCDITHER/RESTARTCINCVCCCSSCRAMPRRAMPRRTRCOMPCCOMPCHFCOUT1COUT2RFB2RFB1CBOOTRU...
2024-12-1214261.53 MB41页91
IC封装资料_电容_CC0603KRX7R9BB333.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12142617.81 MB176页263
IC封装资料_电容_0402X105K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214261.05 MB27页223
IC封装资料_电感_LQP03TN1N8B02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121425281.03 KB12页209
AL-XX1361-F8 (A-BRIGHT).pdf
2006/10/19NOTES:1.Alldimensionsareinmillimeters(inches);2.Tolerancesare±0.1mm(0.004inch)unlessotherwisenoted.�SolderingironBasic...
2024-12-111425337.97 KB5页191
IC封装资料_电源管理芯片_UCC28C43DR.pdf
VINUCC28C43VDDVREFRT/CTGNDCOMPFBCSOUTVOUTCopyright©2016,TexasInstrumentsIncorporatedProductFolderOrderNowTechnicalDocumentsTools&...
2024-12-1214253.88 MB55页151
IC封装资料_电容_TAJE687K004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121425210.32 KB7页277
IC封装资料_电容_TAJD686M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121425210.32 KB7页103
IC封装资料_电容_1206CG821J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214251.05 MB27页97
IC封装资料_电容_CL10B562JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B562JB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121425360.96 KB3页56
IC封装资料_连接器_1843897.pdf
https://www.phoenixcontact.com/us/produkte/184389726.10.2012Page1/6Basestrip-MC1.5/12-GF-3.5-1843897Pleasebeinformedthatthedatasho...
2024-12-121425184.76 KB6页138
IC封装资料_电源管理芯片_LTC4065EDC_TRPBF.pdf
1LTC4065/LTC4065A4065fb■WirelessPDAs■CellularPhones■PortableElectronicsStandalone750mALi-IonBatteryChargerin2×2DFN■CompleteLi...
2024-12-121425292.13 KB16页118
IC封装资料_电感_NLV25T-033J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121425318.58 KB6页106
IC封装资料_电容_0402CG3R3C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214251.05 MB27页295
IC封装资料_电感_SWPA4020S101MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1214241.32 MB22页31
IC封装资料_电源管理芯片_LT1764EQ-2.5_TRPBF.pdf
1LT1764Series1764fb3A,FastTransientResponse,LowNoise,LDORegulators■OptimizedforFastTransientResponse■OutputCurrent:3A■DropoutVo...
2024-12-121424360.65 KB20页26
IC封装资料_电容_GCM1555C1H471JA16D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1214244.17 MB96页106
IC封装资料_电容_CC0402ZRY5V7BB104.pdf
SProductSpecification–March07,2017V.8DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralpurpose&HighcapacitanceClass2,Y5V6.3...
2024-12-1214241.08 MB13页151
IC封装资料_电容_GRM1555C1H2R7BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121424920.26 KB29页277
IC封装资料_电容_TAJB156M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121424210.32 KB7页169

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