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IC资料

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IC封装资料_电容_0402CG5R6C100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214251.05 MB27页28
IC封装资料_电容_0402CG3R3C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214251.05 MB27页295
IC封装资料_电感_LQP03TN1N8B02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121425281.03 KB12页209
IC封装资料_电容_CC0402ZRY5V7BB104.pdf
SProductSpecification–March07,2017V.8DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralpurpose&HighcapacitanceClass2,Y5V6.3...
2024-12-1214251.08 MB13页151
IC封装资料_电源管理芯片_UCC27524AQDRQ1.pdf
1234ENAINAGNDINB8765ENBOUTAVDDOUTBUCC27524A-Q1DualNon-InvertingInputsProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSuppor...
2024-12-1214251.54 MB37页147
IC封装资料_电容_GRM1555C1H2R7BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121425920.26 KB29页277
IC封装资料_连接器_1843897.pdf
https://www.phoenixcontact.com/us/produkte/184389726.10.2012Page1/6Basestrip-MC1.5/12-GF-3.5-1843897Pleasebeinformedthatthedatasho...
2024-12-121425184.76 KB6页138
IC封装资料_电容_CL10C8R2CB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C8R2CB81PNC●Product:Multi-layerCeramicCapacitorCAP,8.2㎊,50V,±0.25㎊,C0G,0603●AEC-Q200Qu...
2024-12-1214245.8 MB36页268
IC封装资料_电容_TAJB156M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121424210.32 KB7页169
IC封装资料_连接器_1766217.pdf
https://www.phoenixcontact.com/us/products/176621710/24/2014Page1/5Basestrip-GMSTB2,5/11-G-7,62-1766217Pleasebeinformedthatthedata...
2024-12-121424168.86 KB5页199
IC封装资料_电感_SWPA3012S100MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1214241.32 MB22页224
IC封装资料_电容_CL10A105KA8NNNL.pdf
IC封装资料_电容_CL10A105KA8NNNL.pdf
2024-12-121424169.87 KB1页264
IC封装资料_电源管理芯片_AZ432ANTR-E1.pdf
AZ432Documentnumber:DS36803Rev.4-31of18www.diodes.comDecember2018©DiodesIncorporatedAZ432NOTRECOMMENDEDFORNEWDESIGN-NOALTERNATEPA...
2024-12-121423582.71 KB18页265
IC封装资料_电容_CL10B471KC8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121423259.58 KB3页132
IC封装资料_电容_CC0201KRX5R5BB104.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1214231.22 MB13页75
IC封装资料_电感_SWPA3015S150MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1214231.32 MB22页98
IC封装资料_电容_0603N470J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214221.26 MB20页234
IC封装资料_电容_0603B331K101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214221.26 MB20页211
IC封装资料_连接器_DF12B_3.0_-40DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121422288.67 KB11页187
IC封装资料_电感_YP1005-2R2M.pdf
SMDPowerInductors-YP1005Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121422776.32 KB5页25

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