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IC资料

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IC封装资料_电容_CC0402KRX5R6BB474.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1214221.22 MB13页135
IC封装资料_电容_GRM155R72A222KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121422920.26 KB29页36
IC封装资料_连接器_1935268.pdf
https://www.phoenixcontact.com/us/products/193526808/04/2015Page1/6PCBterminalblock-PT1,5/12-5,0-H-1935268Pleasebeinformedthatthed...
2024-12-121422172.19 KB6页32
IC封装资料_电容_TAJD107M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121421210.32 KB7页196
IC封装资料_电容_GRM188R71A124KA01D.pdf
GRM188R71A124KA01_(0603,X7R:EIA,0.12uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121421962.4 KB30页93
IC封装资料_电容_CL10A224KP8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A224KP8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1214211.42 MB36页13
IC封装资料_电源管理芯片_LTC2953CDD-1_PBF.pdf
LTC295312953fTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONPushButtonOn/OffControllerwithVoltageMonitoringTheLTC®2953isapushbu...
2024-12-121421292.4 KB20页30
IC封装资料_电容_GRM1555C1HR40BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121420920.26 KB29页153
IC封装资料_电容_CL10B104JO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104JO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121420361.09 KB3页280
IC封装资料_电源管理芯片_LTC4367IDD_PBF.pdf
LTC436714367fbFormoreinformationwww.linear.com/LTC4367TYPICALAPPLICATIONFEATURESDESCRIPTION100VOvervoltage,UndervoltageandReverseS...
2024-12-121420936.56 KB22页160
IC封装资料_过流保护_RL16-200.pdf
PositiveThermalCoefficient(PTC)RL16SeriesSpecificationsaresubjecttochangewithoutnotice.Pleaserefertohttp://www.ruilon.com.cnforcur...
2024-12-121420328.49 KB4页74
IC封装资料_电源管理芯片_LTC3413EFE_TRPBF.pdf
LTC341313413fcTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION3A,2MHzMonolithicSynchronousRegulatorforDDR/QDRMemoryTerminationThe...
2024-12-121420339.57 KB16页69
IC封装资料_微控制器_XM003Q.pdf
XM003（文件编号：S&CIC1807）深圳市富满电子集团股份有限公司SHENZHENFINEMADEELECTRONICSGROUPCO.,LTD.八位单片机www.superchip.cn第1页...
2024-12-1214201.41 MB33页243
IC封装资料_电容_TAJV337M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121420210.31 KB7页295
IC封装资料_电源管理芯片_TL431AFDT8R.pdf
ImportantnoticeDearCustomer,On7February2017theformerNXPStandardProductbusinessbecameanewcompanywiththetradenameNexperia.Nexperiais...
2024-12-121419278.43 KB28页30
IC封装资料_电容_CL03C1R2CA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-1214191.4 MB36页130
IC封装资料_电容_CC1210MKX5R5BB476.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1214191.22 MB13页29
IC封装资料_电感_MLG1005S8N2JT000.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-121418420.58 KB16页63
IC封装资料_三极管_FMD5N50E5.pdf
FMD5N50E5Rev1.0-1-VDSS500VID5ATrr85nsRDS(ON)Typ1.25ΩGeneralDescription：FMD5N50E5,thesiliconN-channelEnhancedVDMOSFETs,isobtained...
2024-12-121418827.69 KB10页285
IC封装资料_电容_TAJB335K025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121418210.32 KB7页229

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