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IC资料

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IC封装资料_电感_LQG18HN18NJ00D.pdf
SpecNo.JELF243B-0002V-01P.1/9MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG18HN□□□□00DREFERENCESPECIFICATION1.ScopeT...
2024-12-121033271.3 KB9页53
IC封装资料_电容_CL10C221FB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121032259.58 KB3页131
IC封装资料_电容_TAJC337M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121032210.32 KB7页82
IC封装资料_连接器_M20-9991646.pdf
更多资料下载请到五八文库wk.58sms.comOBSOLETEAllothersize/finishcombinationsnotlistedaboveM20-99902XXM20-99903XXM20-99904XXM20-9990...
2024-12-121032134.9 KB1页81
IC封装资料_连接器_1844236.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/4-G-3,5OrderNo.:1844236...
2024-12-121032246.82 KB5页157
IC封装资料_电容_GRM1555C2A100JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121032920.26 KB29页10
IC封装资料_电容_GRM1555C1H180JA01D.pdf
GRM1555C1H180JA01_(0402,C0G:EIA,18pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121032944.29 KB30页203
IC封装资料_电源管理芯片_LTC4090EDJC_TRPBF.pdf
LTC4090/LTC4090-514090feFormoreinformationwww.linear.com/LTC4090FEATURESAPPLICATIONSDESCRIPTIONUSBPowerManagerwith2AHighVoltageBat...
2024-12-121032594.61 KB30页283
IC封装资料_电感_SWPA8040S2R2MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1210321.32 MB22页245
IC封装资料_电容_0603F226M100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210321.05 MB27页96
IC封装资料_电容_CC1206JKNPOCBN101.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1210321.22 MB13页141
IC封装资料_电容_0805B821K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210311.05 MB27页108
IC封装资料_电感_SDFL1608Q2R7KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121031457.75 KB7页113
IC封装资料_电源管理芯片_LTC3646EMSE-1_PBF.pdf
LTC3646/LTC3646-1136461fcFormoreinformationwww.linear.com/LTC3646TYPICALAPPLICATIONFEATURESDESCRIPTION40V,1ASynchronousStep-DownCo...
2024-12-121031658.79 KB28页220
IC封装资料_电容_0603CG201J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210311.05 MB27页260
IC封装资料_电源管理芯片_LT1930AES5_TRPBF.pdf
1LT1930/LT1930AAPPLICATIOSUFEATURESDESCRIPTIOUTYPICALAPPLICATIOU1A,1.2MHz/2.2MHz,Step-UpDC/DCConvertersinThinSOTI1.2MHzSwitchingFr...
2024-12-121031279.94 KB12页299
IC封装资料_电容_0603B223K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210311.26 MB20页72
IC封装资料_电感_LQP15MN6N2B02D.pdf
SpecNo.JELF243C-0007P-01P.1/9MURATAMFG.CO.,LTD.ReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP15MN□□□□02DReferenceSpecification1.Scope...
2024-12-121031245 KB9页42
IC封装资料_电容_TAJE108K004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121031210.32 KB7页99
IC封装资料_电容_CL10B682KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121031259.58 KB3页274

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