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IC封装资料_电感_SDCL1608CR47JTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121040376.19 KB4页23
IC封装资料_电容_6SVP330M.pdf
Designandspecificationsareeachsubjecttochangewithoutnotice.Askfactoryforthecurrenttechnicalspecificationsbeforepurchaseand/oruse.S...
2024-12-121040288.66 KB3页223
IC封装资料_电感_MLF2012A3R3KT000.pdf
February2017INDUCTORSFebruary2017积层铁氧体MLF20122012[0805inch]**表示尺寸代码。JIS[EIA]普通电路用电感器MLF2012型MLF系列更多资料下...
2024-12-121039441.86 KB11页11
IC封装资料_电声器件_TMB12A03.pdf
TMB12A03ROHSSPECV1.0规格书SpecificationTMB12A03C96222ROHS品名ModelnamePROPRIETARYHuanengElectronicco.,Ltd.CONFIDENTIALHuanengElect...
2024-12-121039384.14 KB4页164
IC封装资料_连接器_DF12B_3.0_-10DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121039288.67 KB11页13
IC封装资料_电感_WPN252012H4R7MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121039624.92 KB9页231
IC封装资料_电源管理芯片_LT3505EDD_TRPBF.pdf
LT350513505fcTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION1.2A,Step-DownSwitchingRegulatorin3mm×3mmDFNTheLT®3505isacurrentmo...
2024-12-121039896.8 KB24页91
IC封装资料_电感_NLV32T-101J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121039325.74 KB6页262
IC封装资料_电容_0603N9R0C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210381.26 MB20页204
IC封装资料_电源管理芯片_LTC3789EGN_PBF.pdf
LTC378913789fcFormoreinformationwww.linear.com/LTC3789TypicalapplicaTionFeaTuresapplicaTionsDescripTionHighEfficiency,Synchronous,...
2024-12-121038611.07 KB30页9
IC封装资料_电容_GCM1555C1H6R8DA16D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1210385.94 MB73页73
IC封装资料_三极管_IRFB3307ZPBF.pdf
08/19/11Benefits�ImprovedGate,AvalancheandDynamicdv/dtRuggedness�FullyCharacterizedCapacitanceandAvalancheSOA�Enhancedbodydiode...
2024-12-121038405.1 KB11页89
IC封装资料_连接器_SM14B-GHS-TB.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121038661.07 KB4页2
IC封装资料_电容_1206CG471J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210381.05 MB27页58
IC封装资料_连接器_AFC01-S36FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1210381.85 MB10页153
IC封装资料_电容_CL10B225KQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B225KQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210381.45 MB36页198
IC封装资料_电容_TAJB225M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121037210.32 KB7页151
IC封装资料_电容_GRM188R72A681KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121037944.07 KB30页269
IC封装资料_电容_CL10B682JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121037259.58 KB3页154
IC封装资料_电容_GCG219R91H103KA03D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1210375.94 MB73页100

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