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IC资料

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IC封装资料_电容_CL10C820JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121043259.58 KB3页184
IC封装资料_电容_CL10A226MQ8NUNE.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121043259.58 KB3页232
IC封装资料_电感_NLCV32T-150K-EF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121043249.79 KB16页57
IC封装资料_电感_NLV32T-331J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121043224.35 KB10页246
IC封装资料_电容_CC0402KRX7R8BB223.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1210431.22 MB13页204
IC封装资料_连接器_1727104.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12104236.13 MB445页187
IC封装资料_电源管理芯片_AP5100WG-7.pdf
AP51001.2ASTEP-DOWNCONVERTERwith1.4MHzSWITCHINGFREQUENCYAP5100Documentnumber:DS32130Rev.3-21of12www.diodes.comApril2012©DiodesInc...
2024-12-121042490.08 KB12页234
IC封装资料_电容_CL10C221GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121042316.18 KB3页176
IC封装资料_连接器_DF40C-30DS-0_4V_51_.pdf
10.4mmPitch,1.5to4.0mmHeight,Board-to-BoardandBoard-to-FPCConnectorsDF40Series2013.11④■Features1.HighdensitymountingSpacesavingd...
2024-12-1210421.01 MB21页287
IC封装资料_电源管理芯片_REF5025AIDR.pdf
OPA365ADS8326REF5040InputSignal,0Vto4V5VR1124ŸC11nFININVDDGNDREFVINVOUTGND+5VCBYPASS1µFC222µF5VCopyright©2016,TexasInstruments...
2024-12-1210423.2 MB39页46
IC封装资料_电阻_FMF06FTHR010-LH.pdf
SPECIFICATIONFORAPPROVALDATE:CUSTOMER:PARTNAME:MetalStripTypeHalogenFreeCurrentSensingResistorsCUSTOMER'SDWG.NO.CUSTOMER'SPARTNO.P...
2024-12-121042367.83 KB10页102
IC封装资料_电容_0603N270J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210421.26 MB20页36
IC封装资料_电感_NLV32T-150J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121042325.01 KB6页229
IC封装资料_电容_GRM155B11E103KA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12104110.43 MB296页57
IC封装资料_电容_CC1206KRX7R9BB153.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1210411.22 MB13页268
IC资料_HLS27DBY0710C (BANNER).pdf
DatasheetBanner'sHLS27HazardousLocationLEDStripLighthasasturdyaluminumhousingandisencasedinashatterproof,UV-stabilized,polycarbona...
2024-12-151041673.17 KB8页11
IC封装资料_电容_CL10C221JB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C221JB81PNC●Product:Multi-layerCeramicCapacitorCAP,220㎊,50V,±5%,C0G,0603●AEC-Q200Qualif...
2024-12-1210415.8 MB36页217
IC封装资料_电感_YPRH1207-8R2M.pdf
SMDPowerInductors-YPRH1207Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●H...
2024-12-121041737.49 KB5页7
IC封装资料_电容_0805F473M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210411.05 MB27页123
IC封装资料_三极管_IRFP450PBF.pdf
DocumentNumber:91233www.vishay.comS-81271-Rev.A,16-Jun-081PowerMOSFETIRFP450,SiHFP450VishaySiliconixFEATURES•DynamicdV/dtRating•...
2024-12-1210401.62 MB9页22

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