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IC资料

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IC封装资料_电容_0603B153K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129321.05 MB27页35
IC封装资料_电容_GRM31CR60J157ME11L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1293110.43 MB296页13
IC封装资料_电容_CC1206JRNPO0BN681.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12931998.46 KB11页199
IC封装资料_电容_0402CG221G500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129311.05 MB27页205
IC封装资料_电容_TAJB227M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12931210.32 KB7页117
IC封装资料_嵌入式微处理器_SNB8P25011DSG.pdf
SN8P2501D8-BitMicro-ControllerSONiXTECHNOLOGYCO.,LTDPage1Version1.5SN8P2501DUSER’SMANUALVersion1.5SN8P2501DSN8P25011DSSOONNiiXX88...
2024-12-129312.34 MB96页186
IC封装资料_电容_GRM188R60J226MEA0D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12931944.07 KB30页278
IC封装资料_三极管_DMP3130L-7.pdf
DMP3130LDocumentnumber:DS31524Rev.7-31of7www.diodes.comSeptember2017©DiodesIncorporatedDMP3130LNEWPRODUCTP-CHANNELENHANCEMENTMODE...
2024-12-12930696.2 KB7页115
IC封装资料_连接器_1803390.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1293036.13 MB445页211
IC封装资料_电感_YPRH0704-4R7M.pdf
SMDPowerInductors-YPRH0704Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●H...
2024-12-12930730.34 KB5页183
IC封装资料_电感_SDCL1005CR15JTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-12930376.19 KB4页226
IC封装资料_电容_GCM1885C1H680JA16D.pdf
Lsize1.6±0.1mmWsize0.8±0.1mmTsize0.8±0.1mmExternalterminalwidthe0.2to0.5mmDistancebetweenexternalterminalsg0.5mmmin.Sizecodeini...
2024-12-129303.23 MB2页166
IC封装资料_电感_NLV25T-6R8J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12930318.58 KB6页99
IC封装资料_电感_SDCL1005C56NJTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-12929376.19 KB4页162
AL-513RGBC-A (A-BRIGHT).pdf
AAA---BBBRRRIIIGGGHHHTTTA-BRIGHTINDUSTRIALCO.,LTD.PartNo.AL-513RGBC-ADiffNo.5mmRoundType:LEDLamps2006/9/201Notes:1.Alldimensionsar...
2024-12-11929313.81 KB5页22
IC封装资料_三极管_IRF7201TRPBF.pdf
ParameterMax.UnitsVDSDrain-SourceVoltage30VID@TC=25°CContinuousDrainCurrent,VGS@10V7.3ID@TC=70°CContinuousDrainCurrent,VGS@10V5....
2024-12-12929262.08 KB7页236
IC封装资料_电容_TAJE157M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12929210.32 KB7页163
IC封装资料_连接器_DF12B_3.0_-14DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12929288.67 KB11页260
IC封装资料_电容_CL10B563KA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B563KA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12928361.02 KB3页26
IC封装资料_电容_CL10B473KA8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12928259.58 KB3页90

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