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IC资料

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IC封装资料_电容_CL10C820JC81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C820JC81PNC●Product:Multi-layerCeramicCapacitorCAP,82㎊,100V,±5%,C0G,0603●AEC-Q200Qualif...
2024-12-1218715.8 MB36页267
IC封装资料_电源管理芯片_LT3652IMSE_PBF.pdf
LT365213652feFormoreinformationwww.linear.com/LT3652TYPICALAPPLICATIONDESCRIPTIONPowerTracking2ABatteryChargerforSolarPowerTheLT®...
2024-12-121871600.17 KB26页96
IC封装资料_连接器_SM10B-GHS-TB.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121871660.99 KB4页129
AL-XJB361 (A-BRIGHT).pdf
2006/10/18NOTES:1.Alldimensionsareinmillimeters(inches);2.Tolerancesare±0.1mm(0.004inch)unlessotherwisenoted.�SolderingironBasic...
2024-12-111871339.67 KB5页58
IC封装资料_电容_GRM188R71H202KA01D.pdf
GRM188R71H202KA01_(0603,X7R:EIA,2000pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121871962.46 KB30页111
IC封装资料_电容_ERF0JM821F12OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12187115.39 MB230页165
IC封装资料_电容_1206B272K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218711.05 MB27页54
IC封装资料_电容_0402B471K250CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218711.26 MB20页176
IC封装资料_电感_NLV32T-270J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121870325.74 KB6页59
IC封装资料_电容_CL10B105KO84PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B105KO84PNC●Product:Multi-layerCeramicCapacitorCAP,1㎌,16V,±10%,X7R,0603●AEC-Q200Qualifi...
2024-12-1218705.82 MB36页112
IC封装资料_电容_0603N6R8D500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218701.26 MB20页35
IC封装资料_电源管理芯片_TPS5430DDAR.pdf
VINNCNCENAGNDVSENSEBOOTPHTPS5430/31VINVOUT956070809010000.511.52.533.5Efficiency−%IOutput�CurrentAO��Efficiency�vs�Output�C...
2024-12-1218701.16 MB35页271
IC封装资料_电容_C322J222J30C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1218704.24 MB7页73
IC封装资料_电容_1206B271K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218701.05 MB27页279
IC封装资料_电感_YP0705-101M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121869721.48 KB5页55
IC封装资料_电源管理芯片_R1202L521A-TR.pdf
R1202xSeriesSTEP-UPDC/DCCONVERTERwithSHUTDOWNFUNCTIONNO.EA-255-1907251OUTLINETheR1202xSeriesareCMOS-basedPWMstep-upDC/DCconverterI...
2024-12-1218691.37 MB31页283
IC封装资料_电容_0402B183K160CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218691.26 MB20页102
IC封装资料_连接器_1727049.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12186936.13 MB445页70
IC封装资料_电感_SWPA4018S100MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1218691.32 MB22页282
IC封装资料_连接器_1757307.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12186936.13 MB445页164

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