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IC封装资料_电容_CL21B224KCFSFNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B224KCFSFNE·Product:Multi-layerCeramicCapacitor...
2024-12-125141.45 MB36页49
IC封装资料_电容_CC0201KRX5R6BB473.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12514998.46 KB11页70
IC封装资料_电容_C823A102J30C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-125142.9 MB5页33
IC封装资料_电感_NLV32T-022J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12514325.72 KB6页276
IC封装资料_电感_NLCV25T-1R0M-EFD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-12513249.79 KB16页182
IC封装资料_电感_NLV25T-1R8J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV25-PF2520[1008inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV25-PFTypeNLV-PFSeries...
2024-12-12513215.06 KB9页168
IC封装资料_电容_TAJB107M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12513210.32 KB7页43
IC封装资料_电容_GRM1555C1H3R5BA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1251210.43 MB296页216
IC封装资料_电容_C241J104J20C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-125122.29 MB5页131
IC封装资料_电容_TAJD477K004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12512210.32 KB7页153
IC封装资料_电容_TAJC686M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12512210.32 KB7页286
IC封装资料_电容_CL10C010BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12512259.58 KB3页219
IC封装资料_电容_T495C686M016ATE250.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-125121.54 MB23页126
IC封装资料_连接器_KF103-5.0-2P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12512205.01 KB1页30
IC封装资料_电容_CL10B511KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12512259.58 KB3页103
IC封装资料_连接器_DF12_3.0_-10DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12512288.67 KB11页279
IC封装资料_连接器_532611571.pdf
更多资料下载请到五八文库wk.58sms.comDETAILZ注釈NOTE1.コネクタ53261**19の詳細寸法については図面SD-53261-024をご参照ください。REFERT...
2024-12-12512597.48 KB6页14
IC封装资料_电容_CC0402FRNPO9BN120.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-125121.22 MB13页74
IC封装资料_电容_GRM1885C1H111JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12512944.07 KB30页154
IC封装资料_电源管理芯片_LTC4213IDDB_TRMPBF.pdf
LTC421314213fAPPLICATIOSUTYPICALAPPLICATIOUDESCRIPTIOUFEATURESTheLTC®4213isanElectronicCircuitBreaker.Anover-currentcircuitbreake...
2024-12-12512268.14 KB20页86

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