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IC封装资料_电感_NLV32T-R47J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12512325.01 KB6页29
IC封装资料_电容_0402X223K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125121.05 MB27页91
IC封装资料_连接器_9631S-44Z02-GFN4.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12512204.61 KB1页125
IC封装资料_电容_C312A104J4SC000.pdf
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2024-12-125112.19 MB4页25
IC封装资料_电容_T491A475K025AT.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardT2005_T491•8/20/2018FortLauderdale,FL33301USA•954-766-2800•w...
2024-12-125111.47 MB23页84
IC封装资料_电感_NLV25T-015J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12511316.78 KB6页81
IC封装资料_电感_YP0503-150M.pdf
SMDPowerInductors-YP0503Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12510776.48 KB5页292
IC封装资料_电感_YSPI1040-3R3M.pdf
SMDPowerInductors-YSPI1040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-12509702.46 KB5页262
IC封装资料_连接器_1803293.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1250936.13 MB445页57
IC封装资料_连接器_A2001WV-S-6P.pdf
A2001SERIESCHANGJIANGCONNECTORSTEL:+86-755-2995911929959129FAX:+86-755-29959139Http://www.CJT.cn2.00mmpitchwiretoboardconnectorSpe...
2024-12-12509404 KB6页39
IC封装资料_连接器_1757268.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1250936.13 MB445页159
IC封装资料_电源管理芯片_MCP1826S-3302E_DB.pdf
2007-2013MicrochipTechnologyInc.DS22057B-page1MCP1826/MCP1826SFeatures:•1000mAOutputCurrentCapability•InputOperatingVoltageRan...
2024-12-12508955.35 KB38页220
IC封装资料_电容_CC0402BRNPO9BNR75.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-125081.22 MB13页41
IC封装资料_电容_CL10C561JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-125081.39 MB36页131
IC封装资料_电感_SWPA3010S4R7MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-125081.32 MB22页178
IC封装资料_电容_CL05C010CB5NNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-125087.55 MB84页296
IC封装资料_电源管理芯片_LT3506IDHD_TRPBF.pdf
LT3506/LT3506A13506afcDualMonolithic1.6AStep-DownSwitchingRegulatorTheLT®3506isadualcurrentmodePWMstep-downDC/DCconverterwithinte...
2024-12-12508298.65 KB24页218
IC封装资料_电容_TAJB155M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12508210.32 KB7页263
IC封装资料_电容_T520A107M006ATE045.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-125081.54 MB23页180
IC封装资料_连接器_DF12D_3.0_-14DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12508288.67 KB11页246

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