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IC封装资料_电感_SWPA3010S4R7MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-125121.32 MB22页178
IC封装资料_电容_T491A475K025AT.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardT2005_T491•8/20/2018FortLauderdale,FL33301USA•954-766-2800•w...
2024-12-125121.47 MB23页84
IC封装资料_连接器_1803293.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1251236.13 MB445页57
IC封装资料_连接器_DF12D_3.0_-14DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12511288.67 KB11页246
IC封装资料_电感_YP0503-150M.pdf
SMDPowerInductors-YP0503Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12511776.48 KB5页292
IC封装资料_电容_T520A107M006ATE045.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-125101.54 MB23页180
IC封装资料_连接器_A2001WV-S-6P.pdf
A2001SERIESCHANGJIANGCONNECTORSTEL:+86-755-2995911929959129FAX:+86-755-29959139Http://www.CJT.cn2.00mmpitchwiretoboardconnectorSpe...
2024-12-12510404 KB6页39
IC封装资料_连接器_1757268.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1251036.13 MB445页159
IC封装资料_电源管理芯片_LT3497EDDB_TRMPBF.pdf
LT349713497fTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONDualFullFunctionWhiteLEDDriverwithIntegratedSchottkyDiodesTheLT®3497...
2024-12-12510421.42 KB20页154
IC封装资料_电源管理芯片_MCP1826S-3302E_DB.pdf
2007-2013MicrochipTechnologyInc.DS22057B-page1MCP1826/MCP1826SFeatures:•1000mAOutputCurrentCapability•InputOperatingVoltageRan...
2024-12-12509955.35 KB38页220
IC封装资料_电容_CC0402BRNPO9BNR75.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-125091.22 MB13页41
IC封装资料_电容_CL10C561JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-125091.39 MB36页131
IC封装资料_电容_CL10C430JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12509259.58 KB3页130
IC封装资料_电源管理芯片_LT3506IDHD_TRPBF.pdf
LT3506/LT3506A13506afcDualMonolithic1.6AStep-DownSwitchingRegulatorTheLT®3506isadualcurrentmodePWMstep-downDC/DCconverterwithinte...
2024-12-12509298.65 KB24页218
IC封装资料_电感_YSPI1040-3R3M.pdf
SMDPowerInductors-YSPI1040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-12509702.46 KB5页262
IC封装资料_连接器_KF2EDGCR-X-5.0-5P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12509620.86 KB1页130
IC封装资料_连接器_DF12E_5.0_-20DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12509288.67 KB11页10
IC封装资料_电容_TAJB155M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12508210.32 KB7页263
IC封装资料_电容_GRM188R72A103KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12508944.07 KB30页299
IC封装资料_电感_LQG15HSR15J02D.pdf
SpecNo.JELF243B-0010S-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12508361.38 KB11页214

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