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IC资料

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IC封装资料_电容_GRM155R61C105KE01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1250710.43 MB296页108
IC封装资料_电源管理芯片_LTC3425EUH_TRPBF.pdf
LTC342513425fFEATURESAPPLICATIOSUDESCRIPTIOUIHandheldComputersIPoint-of-LoadRegulatorsI3.3Vto5VConversion,LTCandLTareregisteredtra...
2024-12-12507360.58 KB24页210
IC封装资料_电容_AC0402KRX7R9BB102.pdf
85ProductSpecification–July5,2018V.11DATASHEETSURFACEMOUNTMULTILAYERCERAMICCAPACITORSAutomotivegradeNP0/X7R6.3VTO630V0.2pFto2.2µ...
2024-12-125071.06 MB24页270
IC封装资料_电容_GRM188R72A103KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12507944.07 KB30页299
IC封装资料_电容_TAJV157M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12506210.32 KB7页225
IC封装资料_连接器_DF12E_5.0_-20DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12506288.67 KB11页10
IC封装资料_电容_GRM188R71A154KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12506944.07 KB30页202
IC封装资料_连接器_5103308-1.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12506190.54 KB1页219
IC封装资料_电感_LQG15HSR15J02D.pdf
SpecNo.JELF243B-0010S-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12506361.38 KB11页214
IC封装资料_电源管理芯片_TPS3805H33QDCKRQ1.pdf
ProcessorTPS3805H33-Q1R1R21.6V3.3VRESETGNDVDDSENSERESETDVDDCVDDGNDProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&C...
2024-12-125051.31 MB25页195
IC封装资料_三极管_SI7738DP-T1-GE3.pdf
VishaySiliconixSi7738DPNewProductDocumentNumber:69982S09-0536-Rev.C,06-Apr-09www.vishay.com1N-Channel150-V(D-S)MOSFETFEATURES•Hal...
2024-12-12504402.18 KB13页72
IC封装资料_电容_1206B106K100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125041.05 MB27页102
IC封装资料_电感_LQW18AN15NJ00D.pdf
SpecNo.JELF243A-0024Y-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□00DREFERENCESPECIFICATION1.Scope...
2024-12-12504361.69 KB12页8
IC封装资料_电感_SWPA252010S5R6MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-125041.32 MB22页209
IC封装资料_电容_CL10A225KL8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12504259.58 KB3页227
IC封装资料_电源管理芯片_IP5306.pdf
IP5306V1.3http://www.injoinic.com/1/10Copyright©2016,InjoinicCorp.2.1A充电2.4A放电高集成度移动电源SOC1特性同步开关充放电2.4A...
2024-12-12504984.76 KB10页96
IC封装资料_电容_CL10A474KQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A474KQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12503361.46 KB3页272
IC封装资料_电感_SWPA3010S2R2NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-125031.32 MB22页122
IC封装资料_三极管_DMN2041L-7.pdf
DMN2041LDocumentnumber:DS31962Rev.4-31of6www.diodes.comJanuary2019©DiodesIncorporatedDMN2041LN-CHANNELENHANCEMENTMODEMOSFETFeatur...
2024-12-12503622.58 KB6页244
IC封装资料_电源管理芯片_UCC21520DW.pdf
10911DriverVDDBOUTBVSSB1213NCNCUVLODEMODMOD151416DriverVDDAOUTAVSSAUVLODEMODMODFunctionalIsolationReinforcedIsolationDisable,UVLOa...
2024-12-125032.48 MB52页86

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