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IC资料

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IC封装资料_电容_GRM1885C1H300JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12892944.07 KB30页114
IC封装资料_电容_CL21C270JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210801.45 MB36页73
IC封装资料_电源管理芯片_MIC29302WU-TR.pdf
2016-2019MicrochipTechnologyInc.DS20005685B-page1MIC2915X/30X/50X/75XFeatures•HighCurrentCapability:-MIC29150/29151/29152/29153...
2024-12-129262.63 MB42页108
IC封装资料_连接器_1881600.pdf
https://www.phoenixcontact.com/us/produkte/188160003.10.2012Page1/5Basestrip-MCV0.5/7-G-2.5-1881600Pleasebeinformedthatthedatashow...
2024-12-12838171.7 KB5页266
IC封装资料_连接器_1881590.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/4http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMCV0,5/6-G-2,5OrderNo.:188159...
2024-12-121290221.12 KB4页60
IC封装资料_电容_CL10B221KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B221KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12285361.45 KB3页200
IC封装资料_连接器_1881587.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMCV0,5/5-G-2,5OrderNo.:188158...
2024-12-12582247.83 KB5页22
IC封装资料_电容_0805F226M6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127461.05 MB27页105
IC封装资料_电容_GRM1885C1H302JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121051944.07 KB30页279
IC封装资料_电感_YNR6045-100M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12900672.55 KB6页135
IC封装资料_电容_GRM1885C1H301JA01D.pdf
GRM1885C1H301JA01_(0603,C0G:EIA,300pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121227944.1 KB30页229
IC封装资料_电容_CL21C300JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218931.45 MB36页265
IC封装资料_电感_YNR6045-101M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12531672.55 KB6页73
IC封装资料_连接器_1881626.pdf
https://www.phoenixcontact.com/us/produkte/188162603.10.2012Page1/5Basestrip-MCV0.5/9-G-2.5-1881626Pleasebeinformedthatthedatashow...
2024-12-12527171.76 KB5页207
IC封装资料_电源管理芯片_MP1495DJ-LF-Z.pdf
MP1495HighEfficiency3A,16V,500kHzSynchronousStepDownConverterMP1495Rev.1.05www.MonolithicPower.com14/13/2016MPSProprietaryInformat...
2024-12-121321540.21 KB15页197
IC封装资料_连接器_1881613.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/4http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMCV0,5/8-G-2,5OrderNo.:188161...
2024-12-121491221.22 KB4页22
IC封装资料_电容_GRM155R71H222JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121816920.26 KB29页105
IC封装资料_电容_GRM1885C1H330FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12568944.07 KB30页1
IC封装资料_电容_CL21C331JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213561.45 MB36页267
IC封装资料_电容_CL10B221KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12499259.57 KB3页266

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