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IC资料

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IC封装资料_电容_0805F226M160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123131.05 MB27页293
IC封装资料_电容_CL21C390JBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-122967.46 MB84页167
IC封装资料_电感_YNR6045-103M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121074672.55 KB6页273
IC封装资料_电源管理芯片_MP1584EN-LF-Z.pdf
MP15843A,1.5MHz,28VStep-DownConverterMP1584Rev.1.0www.MonolithicPower.com18/8/2011MPSProprietaryInformation.UnauthorizedPhotocopya...
2024-12-121323465.81 KB17页37
IC封装资料_连接器_1935174.pdf
https://www.phoenixcontact.com/us/products/193517408/04/2015Page1/6PCBterminalblock-PT1,5/3-5,0-H-1935174Pleasebeinformedthattheda...
2024-12-121614172.22 KB6页133
IC封装资料_电容_GRM155R71H223KA12D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1291920.26 KB29页54
IC封装资料_连接器_1935161.pdf
https://www.phoenixcontact.com/us/products/193516108/04/2015Page1/6PCBterminalblock-PT1,5/2-5,0-H-1935161Pleasebeinformedthattheda...
2024-12-12670172.21 KB6页43
IC封装资料_电容_0805F226M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127171.05 MB27页66
IC封装资料_电容_GRM1885C1H332JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12475944.07 KB30页85
IC封装资料_电容_GRM1885C1H331JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-1278944.07 KB30页14
IC封装资料_电感_YNR6045-150M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121663672.55 KB6页39
IC封装资料_电容_CL21C470JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B472KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215141.45 MB36页172
IC封装资料_电源管理芯片_MP1593DN-LF-Z.pdf
MP15933A,28V,385kHzStep-DownConverterMP1593Rev.2.11www.MonolithicPower.com11/10/2013MPSProprietaryInformation.PatentProtected.Unau...
2024-12-12599386.58 KB13页242
IC封装资料_电容_CC0402JRNPO9BN180.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-1259517.81 MB176页82
IC封装资料_电源管理芯片_MP1591DN-LF-Z.pdf
MP15912A,32V,330KHzStep-DownConverterMP1591Rev.2.3www.MonolithicPower.com19/21/2007MPSProprietaryInformation.UnauthorizedPhotocopy...
2024-12-121766408.32 KB12页297
IC封装资料_电容_GRM155R71H271KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121453920.26 KB29页269
IC封装资料_电容_CL10B222KB8NCNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B222KB8NCNC·Product:Multi-layerCeramicCapacitor...
2024-12-1289421.77 KB3页72
IC封装资料_电容_CL10B222JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B222JB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121529360.96 KB3页231
IC封装资料_电容_0805F333M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211411.05 MB27页121
IC封装资料_电容_0805F273M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217771.05 MB27页60

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