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IC封装资料_电源管理芯片_TNY278GN-TL.pdf
TNY274-280TinySwitch-IIIFamilywww.powerint.comJanuary2009Energy-Efficient,Off-LineSwitcherWithEnhancedFlexibilityandExtendedPowerR...
2024-12-1218221.09 MB24页300
IC封装资料_电容_T495C686M016ATE250.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-125121.54 MB23页126
IC封装资料_电源管理芯片_TM1638.pdf
LED驱动控制专用电路TM1638www.titanmec.com-1-一、概述TM1638是带键盘扫描接口的LED（发光二极管显示器）驱动控制专用电路，内部集成有MCU...
2024-12-121902962.25 KB18页69
IC封装资料_电容_GCJ32EC7YJ106KA01L.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-125445.94 MB73页44
IC封装资料_电容_GRM188R71H392KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121366944.07 KB30页181
IC封装资料_电容_CL10C1R2BB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12311340.04 KB3页208
IC封装资料_连接器_KF120-2.54-10P.pdf
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2024-12-12674686.3 KB1页257
IC封装资料_连接器_KF120-2.54-9P.pdf
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2024-12-121657686.3 KB1页54
IC封装资料_电容_1206CG560J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212321.05 MB27页253
IC封装资料_电容_GCJ32EC71H106KA01L.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-121425.94 MB73页272
IC封装资料_电感_YPRH1207-181M.pdf
SMDPowerInductors-YPRH1207Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●H...
2024-12-12823737.49 KB5页161
IC封装资料_电源管理芯片_TOP222PN.pdf
Figure1.TypicalFlybackApplication.reducescostinlowerpower,highefficiencyapplications.Theinternalleadframeofthispackageusessixofits...
2024-12-1213971.67 MB20页141
IC封装资料_连接器_KF120-2.54-12P.pdf
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2024-12-12965686.3 KB1页195
IC封装资料_连接器_KF120-2.54-11P.pdf
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2024-12-12141686.3 KB1页253
IC封装资料_电容_GRM188R71H393KA61D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12187944.07 KB30页118
IC封装资料_电容_T495D107K016ATE125.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1211101.54 MB23页192
IC封装资料_电容_CL10C1R5CB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12430340.08 KB3页30
IC封装资料_连接器_KF124-3.5-4P.pdf
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2024-12-121283203.82 KB1页47
IC封装资料_电容_CL10C1R5BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121323259.58 KB3页171
IC封装资料_连接器_KF124-3.5-3P.pdf
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2024-12-121615203.82 KB1页257

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