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IC封装资料_电容_T520B157M006ATE025.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2076_T52X-530•4/28/20171Oneworld.OneK...
2024-12-129032.01 MB37页72
IC封装资料_电源管理芯片_TP4057.pdf
南京拓微集成电路有限公司TP4057南京拓微集成电路有限公司NanJingTopPowerASICCorp.数据手册DATASHEETTP4057(500mA线性锂离子电池充电器)概...
2024-12-12499426.56 KB12页31
IC封装资料_电容_GCJ32ER71C226KE01L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1214804.17 MB96页185
IC封装资料_电容_GRM188R71H472JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12783944.07 KB30页251
IC封装资料_连接器_KF127-5.0-5P.pdf
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2024-12-12926505.5 KB1页26
IC封装资料_电容_CL10C1R8CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121555259.58 KB3页228
IC封装资料_连接器_KF124-3.5-16P.pdf
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2024-12-12695203.82 KB1页47
IC封装资料_电容_CL10C1R8BB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12188340.03 KB3页237
IC封装资料_连接器_KF124-3.5-15P.pdf
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2024-12-121704203.82 KB1页112
IC封装资料_电容_T520B227M006ATE035.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2076_T52X-530•4/28/20171Oneworld.OneK...
2024-12-123102.01 MB37页243
IC封装资料_电容_1206CG681J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217891.05 MB27页299
IC封装资料_电容_T520B157M006ATE070.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2076_T52X-530•4/28/20171Oneworld.OneK...
2024-12-1216102.01 MB37页163
IC封装资料_电感_YPRH1207-470M.pdf
SMDPowerInductors-YPRH1207Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●H...
2024-12-121809737.49 KB5页157
IC封装资料_电容_GCJ32ER71H475KA12L.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-121725.94 MB73页181
IC封装资料_电感_YPRH1207-331M.pdf
SMDPowerInductors-YPRH1207Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●H...
2024-12-12139737.49 KB5页120
IC封装资料_电容_CL10C1R8CB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12261340.09 KB3页190
IC封装资料_连接器_KF127-5.0-9P.pdf
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2024-12-121017505.5 KB1页11
IC封装资料_连接器_KF127-5.0-8P.pdf
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2024-12-1299505.5 KB1页145
IC封装资料_电容_1206CG820J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124391.05 MB27页158
IC封装资料_连接器_KF127-5.0-7P.pdf
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2024-12-12245505.5 KB1页94

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