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IC资料

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IC封装资料_电容_GRM1555C1H101FA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121763920.26 KB29页293
IC封装资料_电容_0805B472K101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1213561.26 MB20页293
IC封装资料_电阻_YC164-FR-074K7L.pdf
120DATASHEETARRAYCHIPRESISTORSYC/TC5%,1%sizesYC:102/104/122/124/162/164/248/324/158T/358L/358TTC:122/124/164RoHScompliantProductSp...
2024-12-12124964.29 KB12页293
IC封装资料_电容_GRM155R61A473KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121317920.26 KB29页293
IC封装资料_电容_GRM1555C1H220FA01D.pdf
GRM1555C1H220FA01_(0402,C0G:EIA,22pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-12326947.48 KB30页293
IC封装资料_过压保护_DESD1P0RFW-7.pdf
DESD1P0RFWDocumentnumber:DS35278Rev.5-21of4www.diodes.comSeptember2011©DiodesIncorporatedDESD1P0RFWADVANCEINFORMATIONLOWCAPACITAN...
2024-12-121059173.74 KB5页293
IC封装资料_接口及驱动芯片_CP2102-GM.pdf
Rev.1.81/17Copyright©2017bySiliconLaboratoriesCP2102/9CP2102/9SINGLE-CHIPUSB-TO-UARTBRIDGESingle-ChipUSBtoUARTDataTransfer-Integr...
2024-12-1218722.16 MB26页293
IC封装资料_电容_C3216X5R1E476MTJ00E.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-123531.61 MB56页293
IC封装资料_电源管理芯片_LTC6803HG-3_TRPBF.pdf
LTC6803-1/LTC6803-31680313faTYPICALAPPLICATIONFEATURESDESCRIPTIONMulticellBatteryStackMonitorTheLTC®6803isa2ndgeneration,complete...
2024-12-121147504.73 KB40页293
IC封装资料_电容_CL10Y105MR5NJND.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL10Y105MR5NJNDProduct:Multi-layerCeramicCapacitor...
2024-12-12867264.15 KB3页293
IC封装资料_电容_GRM1885C1H6R8BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12623944.07 KB30页293
IC封装资料_电感_YNR5040-102M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121405666.66 KB5页293
IC封装资料_电容_CC0402JRNPO9BN101.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12100217.81 MB176页293
IC封装资料_电容_0805F226M160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123131.05 MB27页293
IC封装资料_电感_YNR8040-470M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121809666.38 KB5页293
IC封装资料_电容_CL31B226KPHNFNE.pdf
1.Model:CL31B226KPHNFNE2.DescriptionPartno.Size(inch(mm))Thickness(mm)TemperaturecharateristicsCapacitancevalueCapacitancetoleranc...
2024-12-121188141.53 KB1页293
IC封装资料_电容_GRM1885C2A361JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121329944.07 KB30页293
IC封装资料_电容_0805YC105KAT2A.pdf
18GeneralSpecificationsPARTNUMBER(SEEPAGE4FORCOMPLETEPARTNUMBEREXPLANATION)08055СMA2AT103Size(L”xW”)DielectricX7R=CCapacitanceT...
2024-12-12904593.77 KB4页293
IC封装资料_电容_1206B203K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217911.05 MB27页293
IC封装资料_电源管理芯片_SP4523.pdf
SP4523锂电池充放电SOCV1.3TPOWERSemiconductorhttp://www.tpower-ic.com1概述SP4523是一款集成开关充电和同步升压功能的单芯片解决方案,内...
2024-12-121895479.67 KB5页293

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