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IC资料

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IC封装资料_电容_CL31B226KPHNFNE.pdf
1.Model:CL31B226KPHNFNE2.DescriptionPartno.Size(inch(mm))Thickness(mm)TemperaturecharateristicsCapacitancevalueCapacitancetoleranc...
2024-12-121188141.53 KB1页293
IC封装资料_电源管理芯片_LTC6803HG-3_TRPBF.pdf
LTC6803-1/LTC6803-31680313faTYPICALAPPLICATIONFEATURESDESCRIPTIONMulticellBatteryStackMonitorTheLTC®6803isa2ndgeneration,complete...
2024-12-121150504.73 KB40页293
IC封装资料_电容_0805YC105KAT2A.pdf
18GeneralSpecificationsPARTNUMBER(SEEPAGE4FORCOMPLETEPARTNUMBEREXPLANATION)08055СMA2AT103Size(L”xW”)DielectricX7R=CCapacitanceT...
2024-12-12904593.77 KB4页293
IC封装资料_电感_YPRH1207-102M.pdf
SMDPowerInductors-YPRH1207Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●H...
2024-12-12872737.49 KB5页293
IC封装资料_电容_CL10C040BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121393259.58 KB3页293
IC封装资料_电容_CL10Y105MR5NJND.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:CL10Y105MR5NJNDProduct:Multi-layerCeramicCapacitor...
2024-12-12867264.15 KB3页293
IC封装资料_电感_YNR8040-470M.pdf
SMDPowerInductors-YNR8040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121809666.38 KB5页293
IC封装资料_电源管理芯片_LT1618EDD_TRPBF.pdf
LT16181sn16181618fasAPPLICATIOSUFEATURESDESCRIPTIOUTYPICALAPPLICATIOUTheLT®1618step-upDC/DCconvertercombinesatradi-tionalvoltagef...
2024-12-12525293.68 KB16页293
IC封装资料_电容_GRM033R60J225ME15D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12194410.43 MB296页293
IC封装资料_电容_GRM1555C1H101FA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121763920.26 KB29页293
IC封装资料_电阻_YC164-FR-074K7L.pdf
120DATASHEETARRAYCHIPRESISTORSYC/TC5%,1%sizesYC:102/104/122/124/162/164/248/324/158T/358L/358TTC:122/124/164RoHScompliantProductSp...
2024-12-12125964.29 KB12页293
IC封装资料_电容_GRM1885C1H6R8BA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12623944.07 KB30页293
IC封装资料_电容_TAJB226M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12467210.32 KB7页293
IC封装资料_电容_0603CG430J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122721.05 MB27页293
IC封装资料_电容_C3216X5R1E476MTJ00E.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-123531.61 MB56页293
IC封装资料_电容_1206F224M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126501.05 MB27页293
IC封装资料_电感_NLV25T-3R9J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV25-PF2520[1008inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV25-PFTypeNLV-PFSeries...
2024-12-12134215.06 KB9页293
IC封装资料_电容_CC0402JRNPO9BN101.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12100217.81 MB176页293
IC封装资料_电容_0805B472K101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1213561.26 MB20页293
IC封装资料_电容_GRM188R71A105KA61D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121903944.07 KB30页293

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