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IC资料

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IC封装资料_电容_0603B501K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-128801.26 MB20页224
IC封装资料_电感_NLV32T-2R7J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-12586224.35 KB10页224
IC封装资料_电感_NLV25T-056J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121301318.58 KB6页224
IC封装资料_电容_GCM1555C1H221JA16D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-124704.17 MB96页224
IC封装资料_电容_CC0603KRX5R9BB225.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12240998.46 KB11页224
IC封装资料_电容_0201X473M6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217471.05 MB27页224
IC封装资料_电感_LQW15AN4N7C00D.pdf
SpecNo.JELF243A-0050AA-01P.1/14MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW15AN□□□□00DReferenceSpecification1.Scop...
2024-12-12380343.85 KB14页224
IC封装资料_连接器_1727010.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1218336.13 MB445页224
IC封装资料_电源管理芯片_AZ1117H-5.0TRE1.pdf
AZ1117Documentnumber:DS36736Rev.5-31of32www.diodes.comJanuary2019©DiodesIncorporatedAZ11171ALOWDROPOUTLINEARREGULATORDescriptionT...
2024-12-1215951 MB32页224
IC封装资料_三极管_NZT605.pdf
TolearnmoreaboutONSemiconductor,pleasevisitourwebsiteatwww.onsemi.comPleasenote:AspartoftheFairchildSemiconductorintegration,someo...
2024-12-121493270.77 KB6页224
IC封装资料_电源管理芯片_TPS62743YFPR.pdf
IOUT(mA)Efficiency0.0010.010.1110100100050%55%60%65%70%75%80%85%90%95%100%D006VIN=3.6VVIN=4.2VVIN=5.0VVINENVSEL1VSEL2VSEL3SWVOSGND...
2024-12-1216331.48 MB27页224
IC封装资料_电源管理芯片_TPS53513RVER.pdf
GNDMODEVREGVDDNCVINVINVINTPS53513RFPGOODENVBSTN/CSW1234567892221201918171615PGNDSWSWSWVIN10EN11121314PGNDPGNDPGNDPGNDPGOODFB2328GN...
2024-12-125665.49 MB42页224
IC封装资料_电容_GCJ216R71H472KA01D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1214025.94 MB73页224
IC封装资料_电容_GCJ188R72A152KA01D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1214474.17 MB96页224
IC封装资料_电感_YSPI0530-5R6M.pdf
SMDPowerInductors-YSPI0530Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121575698.99 KB4页224
IC封装资料_电容_TAJA476K002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12349210.32 KB7页224
IC封装资料_电源管理芯片_TPS7A8400ARGRR.pdf
TPS7A84AGND50mV100mV200mV400mV800mV1.6VBIASINENNR/SSOUTPGSNSFBCFFRPGCOUT0.9VOUTToDigitalLoadCIN1.2VINCNR/SSCBIASBiasSupplyANYOUTUs...
2024-12-1213633.13 MB48页224
IC封装资料_电容_T520B157M006ATE035.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2076_T52X-530•4/28/20171Oneworld.OneK...
2024-12-129202.01 MB37页224
IC封装资料_电容_CL10B821KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B821KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121530361.46 KB3页224
IC封装资料_连接器_FH12-9S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-12805339.76 KB6页224

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