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IC资料

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IC封装资料_电容_0201HQ1R2B250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216321.05 MB27页291
IC封装资料_电容_GCM1555C1H6R8BA16D.pdf
GCM1555C1H6R8BA16_(0402,C0G:EIA,6.8pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121550943.98 KB29页291
IC封装资料_电容_1206B391K102NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121971.05 MB27页291
AL-314IR-940-45C (A-BRIGHT).pdf
AAA---BBBRRRIIIGGGHHHTTTA-BRIGHTINDUSTRIALCO.,LTD.PartNo.AL-314IR-940-45CDiffNo.0023mmRoundType：LEDLamps12006/10/2Notes:1.Alldime...
2024-12-111993328.88 KB5页291
IC封装资料_连接器_BM28B0.6-24DP2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12642562.52 KB8页291
IC封装资料_电容_CL31A476MPHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31A476MPHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-123381.48 MB36页291
AB-125TYA-24VD-B3G-0 (A-BRIGHT).pdf
AAA---BBBRRRIIIGGGHHHTTTA-BRIGHTINDUSTRIALCO.,LTD.A-BRIGHT11/2/2006MULTILAMPSLEDBULBDataSheetFeature:HighefficiencyLEDmaterialsare...
2024-12-111995193.79 KB3页291
IC封装资料_电容_1206F104M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210331.05 MB27页291
IC封装资料_电容_GRM1555C1H4R3WA01D.pdf
GRM1555C1H4R3WA01_(0402,C0G:EIA,4.3pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12304944.47 KB30页291
IC封装资料_电容_GRM155R71H123KA12D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12487920.26 KB29页291
IC封装资料_连接器_DF12C-30DS-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121552288.67 KB11页291
IC封装资料_电容_GCJ188R71E102KA01D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-127465.94 MB73页291
IC封装资料_电容_0805N470J501CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1215251.26 MB20页291
IC封装资料_连接器_DF12_3.0_-80DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12497288.67 KB11页291
IC封装资料_电容_1206CG101J101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1217241.05 MB27页291
IC封装资料_电感_YNR6045-4R7M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121603672.55 KB6页291
IC封装资料_数据转换器_AD5668BRUZ-3REEL7.pdf
Octal,12-/14-/16-Bit,SPIVoltageOutputdenseDACwith5ppm/°C,On-ChipReferenceDataSheetAD5628/AD5648/AD5668Rev.JDocumentFeedbackInform...
2024-12-1213321.04 MB30页291
IC封装资料_三极管_2N7002DW.pdf
JIANGSUCHANGJIANGELECTRONICSTECHNOLOGYCO.,LTDSOT-363Plastic-EncapsulateMOSFETswww.cj-elec.com1I,Sep,20162N7002DWDualN-channelMOSFE...
2024-12-123621.49 MB5页291
IC封装资料_电容_GCJ216R72A103KA01D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1218504.17 MB96页291
IC封装资料_电容_CL10B751KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B751KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121819361.15 KB3页291

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