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IC资料

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IC封装资料_电容_CL10C2R2BB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12280316.22 KB3页179
IC封装资料_电容_GCJ31CC71E106KA15L.pdf
GCJ31CC71E106KA15_(1206,X7S:EIA,10uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-12999859.97 KB27页179
IC封装资料_连接器_DF12B_3.0_-32DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121100288.67 KB11页179
IC封装资料_电源管理芯片_SPX3819M5-L-1-2_TR.pdf
SPX3819500mALow-NoiseLDOVoltageRegulatorJuly2018Rev.2.0.41/13Rev.2.0.4GENERALDESCRIPTIONTheSPX3819isapositivevoltageregulatorwitha...
2024-12-1211261.15 MB13页179
IC封装资料_连接器_AFC11-S22ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-123001.4 MB10页179
IC封装资料_电容_EGN2GM8R2G20OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12104815.39 MB230页179
IC封装资料_电容_1206B102K501NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124301.05 MB27页179
IC封装资料_电容_CC0402KRX7R6BB273.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121197998.46 KB11页179
IC封装资料_电容_GRM1885C2A470GA01D.pdf
GRM1885C2A470GA01_(0603,C0G:EIA,47pF,DC100V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12303943.98 KB30页179
IC封装资料_电容_GRM1885C2A3R3CA01D.pdf
GRM1885C2A3R3CA01_(0603,C0G:EIA,3.3pF,DC100V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121091944 KB30页179
IC封装资料_电容_CL10B223KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12399452.9 KB21页179
IC封装资料_电源管理芯片_MP2359DJ-LF-Z.pdf
MP23591.2A,24V,1.4MHzStep-DownConverterinaTSOT23-6MP2359Rev.1.21www.MonolithicPower.com17/18/2011MPSProprietaryInformation.PatentP...
2024-12-12360497.61 KB11页179
IC封装资料_电容_GRM1885C1H222JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121016944.07 KB30页179
IC封装资料_电源管理芯片_XL3003.pdf
Datasheet220KHz36V4A开关电流降压型LED恒流驱动器XL3003Rev1.3www.xlsemi.com1特点�8V到36V宽输入电压范围�0.21V输出电流采样电压�最大...
2024-12-12925644.01 KB13页178
IC封装资料_电容_CL10C140JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12564259.57 KB3页178
IC封装资料_电源管理芯片_TPS562200DDCR.pdf
01020304050607080901000.0010.010.1110Efficiency(%)IOUT-OutputCurrent(A)C007VOUT=1.8VVOUT=3.3VVOUT=5VGND1SW2VIN3VFB4EN5VBST6TPS5622...
2024-12-1210081.34 MB32页178
IC封装资料_电容_TMK105CBJ225KV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121760653.27 KB26页178
IC封装资料_电容_TAJC477M002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12894210.32 KB7页178
IC封装资料_连接器_1803345.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12105836.13 MB445页178
IC封装资料_连接器_KF170V-5.0-7P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121377207.6 KB1页178

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