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IC封装资料_电容_TAJE157K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12518208.56 KB7页158
IC封装资料_电容_CL10C070DB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121133340.05 KB3页158
IC封装资料_电源管理芯片_TPS56121DQPR.pdf
VINBOOTSWILIMFBCOMPPGDEN/SSTPS56121BPVDDGNDVINVOUTVINSDVOUTUDG-11047TPS56121www.ti.com.cnZHCS123A–MARCH2011–REVISEDMAY20124.5-V...
2024-12-126951.46 MB31页158
IC封装资料_电容_CL10C2R5BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121815259.58 KB3页158
IC封装资料_电容_1206CG820J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124391.05 MB27页158
IC封装资料_连接器_KF2EDGCV-X-5.08-11P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121840627.15 KB1页158
IC封装资料_电容_EMK063BJ103KP-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12758857.12 KB55页158
IC封装资料_电感_YP0503-221M.pdf
SMDPowerInductors-YP0503Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121990776.48 KB5页158
IC封装资料_电源管理芯片_RS3002-3_3YSF3.pdf
RS3002REVA.41www.run-ic.com150mA,UltralowPowerConsumption,HighVoltageCMOSLDORegulatorFEATURES•UltralowQuiescentCurrentIQ:2.5µATy...
2024-12-121706660.04 KB15页158
IC封装资料_电容_CL10B223KB85PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12744452.9 KB21页158
IC封装资料_电容_GRM1885C1H300GA01D.pdf
GRM1885C1H300GA01_(0603,C0G:EIA,30pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121631944.06 KB30页158
AL-XJD361-F9 (A-BRIGHT).pdf
2006/10/19NOTES:1.Alldimensionsareinmillimeters(inches);2.Tolerancesare±0.1mm(0.004inch)unlessotherwisenoted.�SolderingironBasic...
2024-12-11817336.16 KB5页157
IC封装资料_三极管_IRFL014NTRPBF.pdf
06/07/04IRFL014NPbF��www.irf.com1HEXFET®PowerMOSFETSDGVDSS=55VRDS(on)=0.16ΩID=1.9AFifthGenerationHEXFET®MOSFETs...
2024-12-121763247.06 KB8页157
IC封装资料_三极管_DMP4065S-7.pdf
DMP4065SDocumentnumber:DS37646Rev.2-21of6www.diodes.comFebruary2015©DiodesIncorporatedDMP4065S40VP-CHANNELENHANCEMENTMODEMOSFETPr...
2024-12-121149582.66 KB6页157
IC封装资料_三极管_DMN601K-7.pdf
DMN601KDocumentnumber:DS30652Rev.10-21of6www.diodes.comJanuary2019©DiodesIncorporatedDMN601KSourceEQUIVALENTCIRCUITGateProtection...
2024-12-121729617.01 KB6页157
IC封装资料_电容_TAJD156M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12440210.32 KB7页157
IC封装资料_电容_GRM219R71H333KA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1214510.43 MB296页157
IC封装资料_电感_YPRH1207-470M.pdf
SMDPowerInductors-YPRH1207Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●H...
2024-12-121809737.49 KB5页157
IC封装资料_电容_T491D475K050AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1211671.54 MB23页157
IC封装资料_电源管理芯片_TLV70033DDCR.pdf
TLV700xxGNDENINOUTVINVOUTOnOffCINCOUT1FCeramic�ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityTLV700SLVS...
2024-12-121641.29 MB37页157

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