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IC资料

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IC封装资料_电感_YPRH1207-470M.pdf
SMDPowerInductors-YPRH1207Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●H...
2024-12-121809737.49 KB5页157
IC封装资料_电容_T491D475K050AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1211671.54 MB23页157
IC封装资料_电源管理芯片_TLV70033DDCR.pdf
TLV700xxGNDENINOUTVINVOUTOnOffCINCOUT1FCeramic�ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityTLV700SLVS...
2024-12-121651.29 MB37页157
IC封装资料_连接器_F0502-B-29-20T.pdf
FPC0.50mmConnectorsF0502-B-XX-20T≥24D更多资料下载请到五八文库wk.58sms.com
2024-12-12492290.85 KB1页157
IC封装资料_电容_CL10B472JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B472JB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121700361.16 KB3页157
IC封装资料_电容_NFM18CC222RIC.pdf
No.JEMCP0-010859BNFM18CCSeriesReferenceSheet1.Scope2.ReferencePARTNo.List123456783.MURATAPartNO.System(Ex.)4.Type&DimensionsNFM18C...
2024-12-121120799.92 KB12页157
IC封装资料_电源管理芯片_REF5050IDR.pdf
OPA365ADS8326REF5040InputSignal,0Vto4V5VR1124ŸC11nFININVDDGNDREFVINVOUTGND+5VCBYPASS1µFC222µF5VCopyright©2016,TexasInstruments...
2024-12-1211194.81 MB40页157
IC封装资料_电容_GRM155R72A332KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12237920.26 KB29页157
IC封装资料_电容_0805N152J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1217901.26 MB20页157
IC封装资料_连接器_1844223.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/3-G-3,5OrderNo.:1844223...
2024-12-12744246.58 KB5页157
IC封装资料_连接器_1844236.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/4-G-3,5OrderNo.:1844236...
2024-12-121032246.82 KB5页157
IC封装资料_电容_GRM1885C1H110JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121539944.07 KB30页157
IC封装资料_电容_CL21B225KPFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B105KPFNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1214661.46 MB36页157
IC封装资料_电容_CC0402BRNPO9BN8R0.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1217591.22 MB13页157
IC封装资料_电源管理芯片_LXDC2UR33A-122.pdf
LXDC2URseriesMicroDC-DCconverter1February20161.FeaturesLowEMInoiseandsmallfootprint(5.75mm2)usinginductor-embeddedferritesubstra...
2024-12-121732830.69 KB27页157
IC封装资料_电感_SWPA4018S680MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1212501.32 MB22页157
IC封装资料_电容_CL05B103KA5NNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-127497.55 MB84页157
IC封装资料_电容_0603X225K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214331.05 MB27页157
IC封装资料_电容_CC0805GKNPO9BN222.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12824998.46 KB11页157
IC封装资料_电感_NLV25T-680J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121667318.58 KB6页157

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