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IC资料

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IC封装资料_电感_YPRH104R-100M.pdf
SMDPowerInductors-YPRH104RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-121456762.21 KB4页145
IC封装资料_连接器_BM28B0.6-50DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121535562.52 KB8页145
IC封装资料_连接器_BM28B0.6-16DS2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-12647562.52 KB8页145
IC封装资料_连接器_AFC11-S26ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-127951.4 MB10页145
IC封装资料_电容_CL10B333KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B333KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121363361.13 KB3页145
IC封装资料_电容_CL31B105KBHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31B105KBHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-125391.45 MB36页145
IC封装资料_电容_CL31B103KBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31F334ZBCNNNC·Product:Multi-layerCeramicCapacitor...
2024-12-128651.45 MB36页145
IC封装资料_连接器_A0801AWR-18-F4MB1-R.pdf
A0801AWR-**-F4M*1-*HU2016.09.28QWY-GCCP-0705更多资料下载请到五八文库wk.58sms.com
2024-12-121663334.91 KB1页145
IC封装资料_电容_GRM1885C1H241JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121255944.07 KB30页145
IC封装资料_电容_0805CG200J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213851.05 MB27页145
IC封装资料_连接器_1829206.pdf
https://www.phoenixcontact.com/us/products/182920610/28/2014Page1/5Basestrip-GMSTBV2,5/7-GF-7,62-1829206Pleasebeinformedthatthedat...
2024-12-121386177.77 KB5页145
IC封装资料_电容_CC0201MRX5R5BB105.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-125991.22 MB13页145
IC封装资料_电容_CC0201MRX5R5BB104.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-12661.22 MB13页145
IC封装资料_电容_CC0201KRX7R9BB331.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12287998.46 KB11页145
IC封装资料_电容_CL10C821JB81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12172259.58 KB3页145
IC封装资料_电容_0805B473J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126741.05 MB27页145
IC封装资料_电感_SDFL1608Q3R3KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-12566457.75 KB7页145
IC封装资料_电容_CL05B104KO5NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL05B104KO5NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210021.45 MB36页145
IC封装资料_电感_SDCL1005C15NJTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121385376.19 KB4页145
IC封装资料_电容_CC1206KKX7RABB473.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12570998.46 KB11页145

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